Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and device for mounting conductive ball

A conductive and spherical technology, which is applied in the field of mounting and mounting devices for conductive spheres, can solve the problems of low mounting rate and increased manufacturing cost.

Inactive Publication Date: 2009-04-08
HITACHI METALS LTD
View PDF9 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conductive spheres with flux attached cannot be smoothly loaded into the positioning aperture, resulting in a low loading rate
Regarding the problem of flux, although sometimes cleaning the mask and conductive ball can also solve it, but the manufacturing cost increases

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for mounting conductive ball
  • Method and device for mounting conductive ball
  • Method and device for mounting conductive ball

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0193] Solder balls B were mounted on five substrates 7 by the mounting device 1a of the first embodiment under the following conditions.

Embodiment 2

[0196] Solder balls B are mounted on five substrates 7 by the mounting device 1b of the second embodiment. In addition, as the linear member 271', SUS430 which is a ferrite magnetic stainless steel is used.

[0197] 3) Comparative example

[0198] In the mounting device 1a of the first form, a dial-in device comprising a bristle-shaped linear member having a sharp portion is incorporated, and the linear member is arranged approximately perpendicularly to the upper surface of the mask 22, and the sharp portion is aligned with the mask 22. In the contact state, the linear member is moved horizontally to mount the solder ball B.

[0199] Table 1 shows the unfilled rate and residual rate of the solder balls B in Examples 1 and 2 and Comparative Example. The residual rate referred to here is defined by (the number of solder balls B remaining on the mask 22 / the number of solder balls dropped).

[0200] [Table 1]

[0201] Unloaded rate

Residual rate

Example ...

Embodiment 3

[0297] An example in which a rosin-based flux diluted with dodecanol having a melting point of 24° C. as a solvent is used as the temporary fixing material f will be described. As such a solvent, butanol (melting point: 25° C.), myristyl alcohol (melting point: 38° C.) and the like can also be used.

[0298] The above-mentioned temporary fixing material f was applied on the electrode 51 in the same manner as in Example 1, and the temporary fixing material f was cooled and solidified to form the temporary fixing film F. When the temporary fixing material f is only flux, its melting point is about -40°C lower than room temperature, so it is difficult to cool and solidify by a usual cooling method. However, if the above-mentioned temporary fixing material is used, it can be diluted by the dodecanol that solidifies at 24°C, so when the temporary fixing material is cooled below the melting point of dodecanol, the dodecanol can be used in a state that contains flux. The alkanol cur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a carrier. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings. The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the carrier. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the carrier through the positioning openings.

Description

technical field [0001] The present invention relates to a mounting method and mounting device for mounting conductive spheres on an array carrier such as electronic components or components used in the manufacture of electronic components in a state of being arranged in a set pattern. Background technique [0002] As an example of an arrangement carrier on which conductive spheres (hereinafter referred to as conductive spheres) are mounted in a state of being arranged in a set pattern, there are, for example, BGA (Ball Grid Array) type and FC ( Electronic components such as semiconductor devices, substrates, or their packages of area array types such as Flip-Chip (Flip-Chip) type with protruding connection bumps. [0003] In recent years, with the development of high speed, high performance, light weight, miniaturization and thinning of portable terminal devices and notebook computers, the electronic components built in them are also required to be miniaturized, thinned and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H01L21/60B23K3/06
CPCH01L2224/11005H01L2224/742H01L2924/014
Inventor 伊藤元通落合正典和井伸一
Owner HITACHI METALS LTD