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Preliminary forming apparatus, preliminary forming method and main forming method using the apparatus, and film with picture

A pre-forming and film technology, applied in the field of pre-forming devices, can solve problems such as the purpose and structure of the invention that are not disclosed, and achieve the effects of easy device maintenance, reduced position deviation, and good durability

Inactive Publication Date: 2009-06-24
今井邦雄
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in this prior art, there is a problem before the precision that the present invention will solve, but the object of the invention and the structure of the present application are not disclosed.

Method used

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  • Preliminary forming apparatus, preliminary forming method and main forming method using the apparatus, and film with picture
  • Preliminary forming apparatus, preliminary forming method and main forming method using the apparatus, and film with picture
  • Preliminary forming apparatus, preliminary forming method and main forming method using the apparatus, and film with picture

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Embodiment Construction

[0041] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0042] Such as figure 1 , 2 As shown, the forming system 1 of the present invention has a main forming device 2 and a preforming device 3 . The preforming device 3 forms and die-cuts the roll-shaped patterned film 4 to produce a formed film 5 that is inserted into the main forming device 2 and used.

[0043] figure 2 The shown main molding device 2 has a mold clamping device 11 and an injection device not shown in the figure. The mold clamping device 11 has a movable platen 11a slidable by four rods 11c and a fixed platen 11b facing it. A movable die 12 and a fixed die 13 serving as main molding dies are attached to the movable platen 11a and the fixed platen 11b, respectively. Main molding as injection molding is performed between these movable molds 12 and fixed molds 13 . The heat-plasticized resin coming out of the injection device is supplied from a ...

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PUM

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Abstract

The object of the present invention is to provide a preforming device, a preforming method, a main forming method and a patterned film used to improve the accuracy of the film pattern and the three-dimensional shape and dimension accuracy of the formed film. The preforming device has upper and lower clamping parts (68j) and heating means (70). The upper and lower clamping members (68j) pinch the patterned film supplied from the film supply device and have a through hole (68a). A heating device (70) is movable close to or away from the preform (F) for heating the patterned film. Through the through hole (68a), the preforming mold (80) for the preforming of the above-mentioned film with pattern (4) and the film release device for demoulding after the preforming of the film with pattern (4) can be used. Move close to or away from the preform F. The preforming die (80) is provided with a male die and a female die, the male die is in contact with the plasticized patterned film, and the female die receives the male die to perform the vacuum forming. A pitch detecting portion for detecting a film mark (M1) is disposed within a pitch width of a traveling direction (X) of the patterned film (4) facing the preform portion (F).

Description

technical field [0001] The present invention relates to a preforming device, which is used for preforming a film with a pattern, and the film is used for insert forming, in-mold forming and the like. More specifically, it relates to a preforming device, a preforming method using the preforming device, a main forming method, and a patterned film. The preforming device includes a film supply device, upper and lower clamping parts, a heating device, a preforming mold, and a film demoulding device. The above-mentioned film supply device supplies the patterned film to the preforming section where preforming is performed. The above-mentioned upper and lower clamping members pinch the patterned film in the preforming part and have through holes. The above-mentioned heating device can be moved close to or far away from the pre-forming part, and before pre-forming, the patterned film held by the upper and lower clamping members is heated, so that the patterned film is placed in the a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C51/02B29C51/16
Inventor 今井邦雄
Owner 今井邦雄