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SMT-free encapsulation method of imaging sensor

An image sensor and packaging method technology, which is applied in the testing, instrumentation, and installation of machine/structural components, and can solve problems such as complex process, image sensor damage, and difficulty in operation.

Inactive Publication Date: 2009-07-01
无锡凯尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, the whole process of SMT rework is complex and difficult to operate, and the cost of SMT is huge. The image sensor is easy to damage the image sensor when the product with poor test after SMT placement is reworked.

Method used

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  • SMT-free encapsulation method of imaging sensor
  • SMT-free encapsulation method of imaging sensor
  • SMT-free encapsulation method of imaging sensor

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0026] 1. Fabrication of the flexible circuit board 1: the pads 16 on it correspond to the solder balls 17 on the image sensor 7, the thickness of the material is 0.13mm-0.15mm soft, and the copper foil must be a high ductility material. In addition, The amount of glue overflow on pad 16 must be less than 1 / 4 of the entire pad area, and the BGA end cannot be pasted and reinforced. The circuit board is required to be made into a jigsaw board to facilitate the subsequent placement of the entire board.

[0027] 2. Prepare the mirror base 3: the bottom of the mirror base 3 needs to be hollowed out to form a positioning groove 4. The size of the positioning groove 4 is 0.2-0.5mm larger than the image sensor 7, so that the image sensor 7 can be embedded inside. The top of the image sensor 7 is just in close contact with the positioning groove 4 of the mirror base 3, the depth of the positioning groove 4 is slightly shallower than the patch height of the image sensor 7 by 0.1mm, and t...

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Abstract

The invention mainly relates to the production and processing technology of a mobile phone camera module using a CSP packaged image sensor. According to the technical solution provided by the present invention, the SMT-free packaging method of the image sensor includes: a. Bonding and positioning: attach the mirror base to the image sensor, insert the positioning post of the mirror base into the positioning hole on the flexible circuit board and fix it The installation hole on the frame, and make the flexible circuit board and the adhesive foam pad attached to the fixed frame fit and bond; b. Fixed locking: After fitting and positioning, make the card slot on the fixed The buckle on the mirror base is stuck; c, hot riveting: riveting the positioning column protruding from the positioning hole and the mounting hole with a hot riveting machine, so that the fixing frame is connected with the flexible circuit board and the mirror base as a whole. The present invention is mainly aimed at the camera module using CSP to package the image sensor. During the assembly process, the image sensor is crimped, which improves the utilization rate of the image sensor and the efficiency of the whole operation.

Description

technical field [0001] The invention mainly relates to the production and processing technology of a mobile phone camera module using a CSP packaged image sensor. Background technique [0002] With the development of electronic products in the direction of miniaturization, portability, networking and high performance, higher requirements are placed on circuit assembly technology and the number of I / O leads. Image sensors are getting smaller and smaller, and image sensor pins are getting smaller and smaller. More and more, it brings difficulties to SMT production and repair. [0003] CSP [Chip Scale Package] means image sensor level package. CSP packaging is the latest generation of memory image sensor packaging technology, and its technical performance has been improved again. The CSP package can make the ratio of the image sensor area to the package area exceed 1:1.14, which is quite close to the ideal situation of 1:1. The absolute size is only 32 square millimeters, whi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/603G02B7/02H04N5/225H05K3/32G01M11/00G01M11/02
Inventor 王宁莉丁建宏周斌
Owner 无锡凯尔科技有限公司