Semiconductor device and semiconductor device manufacturing method
A semiconductor and wire bonding device technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as poor yield, position offset, and increased manufacturing process time, and achieve bonding High strength, prevention of wire breakage, and increased bonding strength
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no. 1 approach
[0073] figure 1 It is a cross-sectional view schematically showing an example of the semiconductor device according to the first embodiment of the present invention.
[0074] Such as figure 1 As shown, the semiconductor device 30 includes: a semiconductor chip 6 having a plurality of electrodes 5 formed on the surface; an island portion 108 to which the semiconductor chip 6 is bonded; and a plurality of lead terminals arranged at predetermined intervals from the island portion 8 . 13; the first lead 2a electrically connecting the electrode 5 on the semiconductor chip 6 to the island portion 8; the double junction portion 25 formed by ball bonding on the second junction portion 10 (not shown); The portion 25 serves as one end of the second lead 2b; the first lead 2c electrically connects the electrode 5 and the lead terminal 13; and the resin encapsulation portion 12 seals these components.
[0075] According to the semiconductor device 30, since the double bonding portion ...
no. 2 approach
[0098] The semiconductor device according to the second embodiment has substantially the same configuration as that of the semiconductor device according to the first embodiment except that there is no second lead and no second bonding portion of the second lead is formed. The description of its configuration is omitted. Here, steps related to wire bonding will be described. Note that components corresponding to those of the semiconductor device according to the first embodiment are described with the same reference numerals.
[0099] Figure 4 (a)~(d) and Figure 5 (a) to (d) are process diagrams schematically showing a process related to wire bonding, which is a part of the manufacturing process of the semiconductor device according to the second embodiment of the present invention.
[0100] First, if Figure 4 As shown in (a), the lead wire 2 is inserted into the small-diameter tube 1, and the tip of the welding torch 3 is opposed to discharge between the lead wire 2, a...
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