Memory module

Abstract

In the memory module, a buffer is disposed on one of at least two circuit boards in the memory module. The buffer is used to buffer signals for memory chips on at least two circuit boards within the memory module.

Description

technical field [0001] The present invention relates to a memory module, and more particularly, to a fully buffered memory module. Background technique [0002] Computer systems often include one or more integrated circuit (IC) chipsets connected to memory modules through a memory interface. The memory interface provides communication between an IC chipset, such as a central processing unit (CPU), and the memory module. The memory interface may include an address bus, command signal lines and a data bus. [0003] Initially, each memory module consisted of a single substrate with memory chips on one or both sides of the substrate. However, the need for high-speed computer performance and capacity has led to a need for a larger and faster memory. To meet this need, a single memory module having two or more electrically connected substrates mounted substantially parallel to each other has been developed. One example of such a memory module is disclosed in US Patent No. 5,94...

AI Technical Summary

Problems solved by technology

[0004] However, as the number of memory chips and / or memory modules connected to the chipset increases and the speed at which they operate, the increase in capacitive load essentially limits memory quantity and speed

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