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Equipment for cleaning down circuit substrate

A technology for circuit substrates and cleaning equipment, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., and can solve problems such as long downtime of cleaning equipment

Inactive Publication Date: 2009-12-30
FREESCALE SEMICON INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can cause lengthy downtimes for cleaning equipment, for example due to the need to recalibrate the internal roller intervals

Method used

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  • Equipment for cleaning down circuit substrate
  • Equipment for cleaning down circuit substrate
  • Equipment for cleaning down circuit substrate

Examples

Experimental program
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Embodiment Construction

[0037] A first aspect of the present invention will now be described, relating to a scrubber-type cleaning method and apparatus designed to reduce differences in cleaning performance across wafers and the like.

[0038] In a first preferred embodiment according to the first aspect of the invention, the conventional brushes used in the scrubber unit are replaced by brushes having a new shape, such as Figures 4A-4C shown. Figure 4A shows a side view of one embodiment of the new brush, while Figure 4B shows along the Figure 4A The profile obtained by the line X-X', while Figure 4C shows along the Figure 4B The profile obtained from the Y-Y' line. The new brushes can be made from the same materials as conventional scrubber brushes.

[0039] Conventional scrubber brushes are cylindrical in shape. if available in Figures 4A-4C As seen in , the brush used in this embodiment of the invention has a generally cylindrical shape, but where the scrubber brush will generally b...

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PUM

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Abstract

Silicon wafers and the like are cleaned by using new scrubber-type apparatus in which measures are taken to compensate for differential cleaning of the central region of the wafer by: using rotary brushes having one or more non-contact portions arranged in the section thereof that faces the central region of the substrate, or toggling the relative position of the wafer and the rotary brushes, or directing cleaning fluid(s) preferentially towards the central region of the wafer. Another aspect of the invention provides scrubber-type cleaning apparatus in which the rotary brushes are replaced by rollers (110). A web of cleaning material (116) is interposed between each roller and the substrate. Various different webs of cleaning material may be used, e.g. a length of tissue, a continuous loop of cleaning material whose surface is reconditioned on each cleaning pass, adhesive material provided on a carrier tape, etc.

Description

technical field [0001] The invention relates to the field of manufacturing circuit devices, in particular to the field of cleaning circuit substrates. Background technique [0002] When fabricating circuitry, it is often necessary to clean the substrate on which the circuitry is formed and / or mounted. Cleaning of circuit substrates is especially important in the manufacture of integrated circuit devices on semiconductor substrates. [0003] During the fabrication of integrated circuit devices on semiconductor substrates, such as silicon wafers, many cleaning steps need to be performed. During these cleaning processes it is often necessary to remove impurities such as trace metals and particles from the surface layer carried on the semiconductor substrate without damaging structures already formed on said surface (or those surfaces). The type and strength of the forces holding the impurities on the surface vary. Cleaning processes are particularly challenging in the case o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
CPCH01L21/67046
Inventor 亚诺什·法尔卡斯斯尔詹·科尔迪克塞巴斯蒂安·珀蒂迪迪埃凯文·E·库珀扬·范-哈塞尔
Owner FREESCALE SEMICON INC
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