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Shear test device

A technology of test head and test device, which is applied in the direction of applying stable shear force to test material strength, test material hardness, measuring device, etc., can solve problems such as difficulty in detecting shear force

Inactive Publication Date: 2011-04-06
DAGE PRECISION INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the case of impact testing where the tool is moved at high speed prior to contact with the solder ball deposit, shear forces are not easily detected

Method used

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Examples

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Embodiment Construction

[0034] Referring to the drawings, FIG. 1 shows a prior art test apparatus comprising a support surface 11 and a test head 12 movable horizontally (XY) and vertically (Z) relative thereto. The test head comprises a fixture to which a tool mount 15 is attached by means of parallel arms 16 . The test tool 17 is arranged on the tool mount 15 .

[0035] In use, the tool is moved laterally in the direction of arrow 14 towards the solder ball deposit mounted on surface 11 to conduct a shear test and force is determined by a strain gauge responding to the deflection of arm 16 . The tip of the test tool 17 is typically very small and of the order of the diameter of the solder ball deposit, ie in the range of 50-1000 μm.

[0036] Figure 2 shows a first embodiment of the invention and shows a tool 20 comprising a support element 21 whose upper end 22 is adapted to be connected directly to a prior art test head 12 or to it in any suitable manner. fixture. The latter device ensures inte...

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PUM

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Abstract

Shear test apparatus for gold and solder balls of a semi-conductor substrate comprises a support element (21) on which is provided a piezo electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.

Description

technical field [0001] This invention relates to apparatus for testing the shear strength of bonds in semiconductor devices, and more particularly, to testing the bond between a substrate and a device electrically connected to it (typically, a partially spherical part of solder or gold). deposition) strength equipment. Background technique [0002] Semiconductor devices are very small, typically from 0.2 mm2 to 25 mm2. These devices have sites for bonding electrical conductors thereto. Said sites typically comprise partial globular deposits of gold or solder, collectively referred to as balls, which in use have an oblate or low dome shape and a diameter in the range 50-1000 μm. These deposits form electrical pathways between, for example, printed circuit boards and chips, and may connect components directly, or may be bonded to conductors that themselves connect to another component. Many such solder balls may be provided as a regular grid-like array on the substrate. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/00G01N3/24G01N3/42H01L21/84H01L29/84
Inventor 罗伯特·约翰·赛科斯
Owner DAGE PRECISION INDS