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Recognition method and system

A recognition method and orientation technology, applied in the field of recognition, can solve problems such as poor efficiency, and achieve the effect of improving recognition efficiency

Active Publication Date: 2007-08-29
TAIWAN SEMICON MFG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the currently implemented defect pattern recognition relies on the establishment of complex recognition rules or complex models, so the efficiency is low

Method used

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  • Recognition method and system
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Embodiment

[0050] Preferred embodiments according to the present invention will be described below. It must be noted that the present invention provides many applicable inventive concepts, and the specific embodiments disclosed are only illustrative of specific ways to achieve and use the present invention, and are not intended to limit the scope of the present invention.

[0051] FIG. 1A shows a simplified flowchart of a method 100 for identifying defect patterns on a substrate formed during a substrate processing process in a semiconductor manufacturing plant according to an embodiment of the present invention. The method 100 begins at step 112 by collecting raw data of a defect image on a substrate. The substrate may be a semiconductor wafer, a mask, or other substrates, such as thin-film-transistor liquid crystal display (TFT-LCD) substrates processed in display manufacturing plants. Taking a wafer as an example, the wafer can undergo multiple processing processes in a semiconductor...

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Abstract

The present disclosure provides a system and method for recognizing a defect image associated with a semiconductor substrate. In one example, the method includes collecting defect data of the defect image by testing and measuring the semiconductor substrate, extracting a pattern from the defect data, normalizing a location, orientation, and size of the pattern, and identifying the pattern after the pattern is normalized. So, the invention can enhance the efficiency of identification.

Description

technical field [0001] The present invention relates to an identification method and system, and in particular to a method and system for identifying defect images related to semiconductor substrates. Background technique [0002] Each semiconductor integrated circuit chip includes a plurality of chips. Chips are made through multiple processing steps in a wafer fabrication plant. Each process step creates defects such as quality and reliability issues, failures, and reduced yields. In order to improve manufacturing technology and increase chip (wafer) quality, reliability and yield, failure mode analysis is used to measure, test, monitor and analyze semiconductor wafers. The analysis methods described above include defect pattern recognition. However, the currently implemented defect pattern recognition relies on the establishment of complex recognition rules or complex models, so the efficiency is low. Contents of the invention [0003] In view of this, the present i...

Claims

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Application Information

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IPC IPC(8): H01L21/66G01N21/88G01N21/956G06K9/00
CPCG01N21/95607G01N21/9501
Inventor 林宸霆周志成吴志宏张家华
Owner TAIWAN SEMICON MFG CO LTD