Manufacturing method of wiring substrate and mask used for printing

Abstract

The present invention provides a method of manufacturing a wiring board whose surface can be formed flat without causing problems such as pinholes when filling a through-hole inside a through-hole conductor formed on a substrate to be filled with a resin paste, and its use. mask for printing. This printing mask (41) is a printing mask used when printing a filling resin paste (31) in a through hole (13) on a substrate to be filled (20) having a plurality of through holes (13) ( 41), characterized in that, on the substrate to be filled (20), adjacent through holes (13) form a through hole group (14) at an interval of 0.1 mm or less, and the printing mask (41) has an opening (43), when the printing mask is arranged on the main surface of the substrate to be filled (20), the opening is formed to correspond to a surface area surrounded by the through-hole group (14) on the main surface. shape.

Description

technical field [0001] The present invention relates to a method for manufacturing a wiring board and a mask for printing. Background technique [0002] A wiring board has multiple conductors (electrodes) on one main surface for mounting electronic components such as LSIs and IC chips, and multiple conductors (electrodes) on the other main surface for connection to a motherboard, etc. , and objects with connection terminals provided thereon. In order to achieve high-density integration of electronic components such as LSIs, IC chips, and chip capacitors mounted on this type of wiring board, high-density wiring and multi-terminals are required. [0003] As an internal structure of a wiring board with a high-density wiring function, on the core substrate located in the center in the thickness direction of the wiring board, a wiring layer connecting the wiring layer on the front surface of the core substrate and the wiring layer on the back surface is formed. Multiple via con...

AI Technical Summary

Problems solved by technology

[0009] However, if the pitch between adjacent openings of the mask becomes narrow, the formation positions will interfere with each other and the opening area will be limited, so the capacity to fill and print the resin paste in the corresponding through-holes may not be sufficiently supplied. For example, if the resin paste that fills the holes wets and expands or hardens and shrinks on the surface of the substrate, the surface of the resin paste printed on the through hole will be concave than the surface of the filled substrate (pinholes occur), and the resin paste will have May not fill hole perfectly even

In addition, since the interval between adjacent openings on the mask is narrow, if force is applied when pressing the resin paste, the boundary portion may be damaged.

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