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Bump structure, method of forming bump structure, and semiconductor apparatus using the same

A bump structure, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as poor connection reliability

Inactive Publication Date: 2007-11-07
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the connection reliability between the connection pad 207 and the bump structure 218 deteriorates.

Method used

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  • Bump structure, method of forming bump structure, and semiconductor apparatus using the same
  • Bump structure, method of forming bump structure, and semiconductor apparatus using the same
  • Bump structure, method of forming bump structure, and semiconductor apparatus using the same

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Embodiment approach 1

[0035] FIG. 1( a ) is a cross-sectional view showing a bump structure according to Embodiment 1 of the present invention, and FIG. 1( b ) is a plan view thereof. As shown in FIG. 1( a ) and FIG. 1( b ), in the bump structure of this embodiment, electrode pads 2 are provided on the semiconductor chip 1 . The electrode pad 2 is provided with a crimping solder ball 3a, and a lead arc 3b formed of an arc-shaped lead extends from the crimping solder ball 3a. At this time, the above-mentioned lead loops 3b are formed so as to protrude from the ends of the crimped balls 3a. In addition, "protruding from the end of the pressure-bonding ball" described in the specification of the present application means a state in which the lead arc protruding from the pressure-bonding ball exists not only on the pressure-bonding ball but also on the surface of the pressure-bonding ball. In such a state as to press-bond the outside of the end of the solder ball.

[0036] As described above, in the ...

Embodiment approach 2

[0053] FIG. 2( a ) is a cross-sectional view showing a bump structure according to Embodiment 2 of the present invention, and FIG. 2( b ) is a plan view thereof. As shown in FIG. 2( a ) and FIG. 2( b ), in the bump structure of this embodiment, electrode pads 12 are provided on the semiconductor chip 11 . The electrode pad 12 is provided with a crimping solder ball 13a, and a lead arc 13b formed of an arc-shaped lead extends from the crimping solder ball 13a. At this time, the above-mentioned lead arc 13b protrudes from the press-bonded solder ball 13a.

[0054] As described above, in the bump structure of the present embodiment, the lead arc 13b is formed of an arc-shaped lead. The above-mentioned arc shape is not particularly limited, as long as it is in a state where the vicinity of the start point and the vicinity of the end point of the lead arc are connected to each other. For example, the arc shape is preferably oval or circular. In addition, known and appropriate le...

Embodiment approach 3

[0068] 3 is a plan view of a bump structure according to Embodiment 3 of the present invention. As shown in FIG. 3 , in the bump structure of this embodiment, electrode pads 22 are provided on a semiconductor chip (not shown). The electrode pad 22 is provided with a pressure-bonded solder ball 23a, and a plurality of lead arcs 23b formed of arc-shaped leads extend from the pressure-bonded solder ball 23a. That is, a plurality of lead loops 23b are formed on one crimp ball 23a. In addition, the bump structure of this embodiment may be a bump structure having a plurality of lead loops 3 b described in Embodiment 1 above, or a bump structure having a plurality of lead loops 13 b described in Embodiment 2 above. Alternatively, a bump structure having both the lead loop 3b described in the first embodiment and the lead loop 13b described in the second embodiment may be used. In addition, in the bump structure of the present embodiment, a plurality of lead loops 23b may be formed ...

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Abstract

A bump structure includes a squashed ball provided on an electrode pad, and a wire provided on the squashed ball. The wire is a wire loop that is loop-shaped and is formed so as to protrude from an end part of the squashed ball. This provides high bonding reliability between a bonding pad and the bump structure.

Description

technical field [0001] The present invention relates to a bump structure and its forming method and a semiconductor device using the bump structure, in particular to a bump structure applicable to flip-chip connection, its forming method and a semiconductor device using the bump structure , wherein, through the above-mentioned flip-chip connection, the refinement of the electrode pad (pad) of the semiconductor chip can be realized. Background technique [0002] In recent years, as a method of mounting a semiconductor device on a circuit board, a packaging method using flip-chip connection has been studied. A bump structure is employed in the above-mentioned flip chip connection. [0003] In Patent Document 1 (Japanese Patent Application Laid-Open Publication No. Hei 8-264540, publication date: October 11, 1996), as the above-mentioned bump structure, a method including a first bump and a second bump is disclosed. bump structure, wherein the first bump is made of a conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/603B23K20/00B23K101/40
CPCH01L2224/83851H01L24/83H01L2224/2919H01L2924/0001H01L2924/01082H01L2224/78301H01L24/13H01L2224/1134H01L2224/13012H01L24/78H01L2924/01005H01L2924/01033H01L2224/4809H01L2924/01006H01L2924/00013H01L2224/13099H01L2224/13016H01L24/11H01L2924/014H01L2224/05573H01L2224/05568H01L2924/00014H01L2224/16106H01L2224/13017H01L2924/00012H01L2224/05599H01L2224/45015H01L2924/207H01L2224/45099G01R1/06H01L21/56
Inventor 矢野祐司玉置和雄
Owner SHARP KK