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Diluent free epoxy resin formulation

An epoxy resin, thinner technology, applied in plastic/resin/wax insulators, winding insulation materials, organic insulators, etc., can solve problems such as worker health and environmental hazards

Inactive Publication Date: 2008-01-23
ABB RES LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem is, these thinners evaporate during the dipping and curing process, posing a potential hazard to worker health and the environment

Method used

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  • Diluent free epoxy resin formulation
  • Diluent free epoxy resin formulation
  • Diluent free epoxy resin formulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Preparation of diluent-free resin formulations does not require complex equipment. First, the crystalline bisphenol F diglycidyl ether resin was melted at 50°C. Then, a defined amount of bisphenol A diglycidyl ether was added, and the mixture was stirred. A defined amount of catalyst is then added and the mixture is stirred again. The resulting mixture is then prepared for use in the preparation of insulating materials as described in the specification. Table 1 gives several examples of formulations. Example D is a comparative example.

[0030] The bisphenol F diglycidyl ether resin has an epoxy equivalent of 157-167, which is 0.6-7% greater than the calculated minimum epoxy equivalent of the compound.

[0031] The bisphenol A diglycidyl ether resin has an epoxy equivalent of 171-176, which is 0.6-4% greater than the calculated minimum epoxy equivalent of the compound.

[0032] Table 1

[0033] combination ：

A

B

C

D

...

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Abstract

A diluent free epoxy resin formulation, which is suitable for the use as coil insulation material, wherein said formulation comprises (a) a purified grade of at least one diglycidyl ether of a bisphenol compound or at least one cycloaliphatic diglycidyl ether compound or a mixture of such compounds, wherein said compounds have an epoxy equivalent weight not exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (b) that said formulation optionally further comprises up to 50% by weight of a diglycidyl ether of a bisphenol compound or of a cycloaliphatic diglycidyl ether compound or a novolac epoxy or a mixture of such compounds, wherein said compounds have an epoxy equivalent weight exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (c) a polymerization catalyst; an electric conductor carrying an impregnated insulation layer insulated with a diluent free epoxy resin formulation as coil insulation material according to the invention.

Description

technical field [0001] The present invention relates to a thinner-free epoxy resin formulation suitable for use as coil insulation. Background technique [0002] In electrical generators, curable resins are commonly used to impregnate insulation, such as mica paper, that is wound around electrical conductors such as the coils of a stator. These resins act as adhesives between the different layers and provide good electrical insulation for the coils. A common way of dispersing the resin into the layers and coils involves, for example, immersing the unimpregnated stator in a bath of resin under vacuum, followed by pressurization. After a few hours of impregnation, the stator is placed in an oven to cure the resin. This method is known as the vacuum pressure impregnation (VPI) method. An important requirement for the resin is that it should have a viscosity low enough to impregnate the thick layers of mica tapes typically used for electrical generators. To achieve this low ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/08C08G59/68H01B3/40
CPCH01B3/40H01F5/06C08G59/38C08G59/226H02K3/30C08G59/68
Inventor 谢里夫·古勒沙维尔·科恩曼萨伊亚·帕科宁汉斯-阿克·埃里克森奥斯莫·科波宁斯特凡诺·基耶雷加托
Owner ABB RES LTD