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Solar battery made of smashed silicon slice and preparation method thereof

A technology of solar cells and broken silicon wafers, applied in the field of solar cells, can solve the problems of reducing manufacturing costs and difficulty in preparing silicon spheres, and achieve the effects of reducing manufacturing costs, high material utilization, and high quality

Inactive Publication Date: 2008-02-27
NANKAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation of the silicon sphere itself is difficult, so it is difficult to further reduce the manufacturing cost

Method used

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  • Solar battery made of smashed silicon slice and preparation method thereof

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Embodiment 1

[0028] Solar cells are made from silicon wafers that are broken after slicing during the production of solar cells. The resistivity of the silicon wafer is 5 ohm cm P-type polysilicon, the thickness is 0.3 mm, and the size is 0.5 cm 2 ~3cm 2 In between, after cleaning, spread the silicon wafer evenly on the quartz tray, and put it into the diffusion furnace for phosphorus diffusion. The diffusion method used is the same as that used to prepare polycrystalline silicon solar cells. A PN junction is formed on the upper surface of the silicon wafer.

[0029] After diffusion, use an acid-resistant glue, such as black glue whose main component is asphalt, to cover the diffused N surface, and then put it into a silicon etching solution for etching. The N layer diffused to the edge of the silicon wafer and the N-type layer diffused to the P surface are etched away to expose the P-type silicon inside the silicon wafer. After etching, the glue covering the N-type surface is removed....

Embodiment 2

[0034] Solar cells are made from leftovers from integrated circuits. P-type monocrystalline silicon with a resistivity of 5 ohm cm, a thickness of 0.3 mm, and a size of 0.5 to 3 cm 2 In between, after cleaning, spread the silicon wafer evenly on the quartz tray, and put it into the diffusion furnace for phosphorus diffusion. The diffusion method used is the same as that used to prepare polycrystalline silicon solar cells. A PN junction is formed on the upper surface of the silicon wafer.

[0035] After diffusion, use an acid-resistant glue, such as black glue whose main component is asphalt, to cover the diffused N surface, and then put it into a silicon etching solution for etching. The N layer diffused to the edge of the silicon wafer and the N-type layer diffused to the P surface are etched away to expose the P-type silicon inside the silicon wafer. After etching, the glue covering the N-type surface is removed. A layer of aluminum is deposited on the P-type surface by ...

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Abstract

The present invention relates to a kind of solar cell made of silicon wafer fragments or IC scraps and its processing method. Firstly, the silicon wafer is dispersed with PN junctions and P-P+ back field to form elementary cells. Secondly, a plate is paved by many cells, and PN junctions of the each cell are arranged in small direction; using insulating resin, a big plate is paved by these cells to form a big cell substrate. Thirdly, according to the silicon-wafer-distributed image taken by digital camera, laser etching machine is controlled to strip the resin layer covering silicon wafer and expose clean surface of the silicon wafer. Fourthly, metal layer is deposited on P-type surface of the silicon wafer to contribute lower surface electrode of the solar cell. Fifthly, transparent conductive layer is deposited on N-type surface of the silicon wafer to contribute upper surface electrode of the solar cell. Sixthly, gate metal external electrode is deposited on the transparent conductive layer. Finally, an antireflection layer is deposited on the transparent conductive layer and the gate metal external electrode.

Description

technical field [0001] The invention relates to a solar cell, in particular to a solar cell prepared with broken silicon wafers and a preparation method thereof. Background technique [0002] In this specification, the light-receiving side of a solar cell is referred to as an upper surface or an upper surface, and the opposite surface is referred to as a lower surface or a rear surface. The electrode drawn from the upper surface is called the upper electrode, and the electrode drawn from the lower surface is called the lower electrode or the back electrode. [0003] Traditional crystalline silicon solar cells include monocrystalline silicon solar cells and polycrystalline silicon solar cells. This type of solar cell is made of boron-doped single crystal or polycrystalline silicon wafers, and its resistivity is between 0.1 ohm cm and 30 ohm cm. Phosphorus is diffused on the upper surface to form a PN junction. In order to reduce the reflection on the surface of the battery,...

Claims

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Application Information

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IPC IPC(8): H01L31/042H01L31/18H01L31/048
CPCY02E10/52Y02E10/50Y02P70/50
Inventor 刘维一
Owner NANKAI UNIV