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Etching liquid and method for manufacturing patterned conductive layer using the same

A technology of patterned conductive layer and manufacturing method, which is applied in the direction of semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as damage to industrial safety, difficult control of etchant concentration stability, and hazards, so as to save process time Effect

Inactive Publication Date: 2010-06-09
台湾薄膜电晶体液晶显示器产业协会 +7
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the stability of the concentration of the etching solution with hydrogen peroxide as the main formula is not easy to control, and the concentration of hydrogen peroxide is too high to cause damage to the components of the machine and doubts about industrial safety hazards

Method used

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  • Etching liquid and method for manufacturing patterned conductive layer using the same
  • Etching liquid and method for manufacturing patterned conductive layer using the same
  • Etching liquid and method for manufacturing patterned conductive layer using the same

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Embodiment Construction

[0039] The etching solution of the present invention includes peracetic acid, peracetic acid stabilizer, organic acid, inorganic acid, salts and water, which can etch two metal layers with different materials in a multilayer structure in one step, or be used to etch a single layer of metal layer. The multilayer structure is, for example, a first metal layer / second metal layer double-layer structure or a second metal layer / first metal layer / second metal layer three-layer structure, wherein the first metal includes copper and its alloys; the second metal It is selected from the group consisting of molybdenum, silver, tantalum, titanium, chromium, nickel, tungsten, gold and their alloys. The single metal layer is a copper alloy layer, wherein the alloy elements of the copper alloy layer are selected from the group consisting of magnesium, silver, chromium, tungsten, molybdenum, niobium, nitrogen, silver, ruthenium, carbon and their mixed alloys.

[0040] The content of peracetic...

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Abstract

An etching solution is provided, which can be used for eroding composite structures comprising copper. The etching solution takes peracetic acid as the main component for etching. The etching solutionadditionally comprises peracetic-acid stabilizer, organic acid, inorganic acid, salt and water. The contents of the peracetic acid, the peracetic-acid stabilizer, the organic acid, the inorganic acidand the salt are respectively 5 to 40wt per cent, 5 to 15wt per cent, 5 to 10wt per cent, 5 to 15wt per cent and 8 to 15wt per cent of the total etching solution.

Description

technical field [0001] The invention relates to an etching solution and a method for manufacturing a patterned conductive layer of an electronic component using the etching solution. Background technique [0002] As the size of the thin film transistor liquid crystal display (TFT-LCD) panel becomes larger and larger, it is accompanied by the resistance capacitance (RC) delay effect caused by the resistance of the metal wire not being low enough, thus causing distortion and distortion of the signal during transmission. , which affects the presentation of panel quality. Using low-resistance copper metal to form the metal wire can effectively reduce the RC delay effect. However, due to the poor adhesion between copper and the glass substrate, and because copper metal is easy to diffuse, it is often necessary to use other metals such as molybdenum as an adhesive layer to increase the adhesion between it and the glass substrate, and as a barrier layer to prevent diffusion. [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/16C23F1/26H01L21/3213H01L21/336H01L29/43
Inventor 刘思呈杨承慈吴健为梁硕玮
Owner 台湾薄膜电晶体液晶显示器产业协会