Substrate cleaning device

Abstract

A substrate clean device used for making substrates includes a connecting part and a magnetic absorption clean part. The connecting part is equipped with a penetration hole and an opening which is connected with the penetration hole. The magnetic absorption clean part passes through the connecting part through the penetration hole. And a part of the magnetic absorption clean part is exposed to the opening part of the connecting part. The substrate clean device is applied to a substrate cleaning system, which includes a substrate bearing device. A bearing glass substrate is arranged on the substrate bearing device. The substrate clean device is arranged above the substrate bearing device. And the opening of the substrate clean device faces downwards and faces the substrate bearing device. Therefore, the part of the magnetic absorption clean part exposed to the opening can absorb metal particles on the glass substrate facing the glass substrate, which is borne on the substrate bearing device.

Description

technical field [0001] The present invention relates to a substrate cleaning device; specifically, the present invention relates to a substrate cleaning device used for manufacturing substrates and a substrate cleaning system using the substrate cleaning device. Background technique [0002] Recently, flat panel displays are widely used in liquid crystal televisions, computers, mobile phones and personal digital assistants (Personal Digital Assistant, PDA). Among them, the glass substrate is one of the important key materials in the manufacturing process of the flat panel display panel. However, the substrate cleaning systems used in the current substrate manufacturing process have problems that need to be improved. [0003] Please refer to FIG. 1 a , which is a schematic cross-sectional view of a substrate cleaning system 10 used in conventional technology. The traditional substrate cleaning system 10 includes a substrate cleaning device 100 and a substrate carrier device ...

AI Technical Summary

Problems solved by technology

In the substrate manufacturing process, when cleaning and printing the glass substrate, because the part of the magnetic cleaning part 130 covered by the connecting part 110 of the traditional substrate cleaning system 10 cannot absorb the metal particles falling on the glass substrate, the magnetic The magnetic attraction force of the suction cleaner 130 cannot exert its maximum effect, which affects the performance of the substrate cleaning device 10 and causes residual metal particles to wear the surface of the substrate

In addition, since the magnetic cleaning part 130 is an elongated columnar structure, even with the support of the connecting part 110, there may still be bending (bending) phenomenon during erection, so the connection sleeved on the magnetic cleaning part 130 is often Part 110 hits the glass substrate 700 below, and scratches the glass substrate 700

The above two situations make the production pass rate of the substrate unable to improve, which in turn affects the manufacturing pass rate of the flat panel display panel

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