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Laser processing

一种激光加工头、激光加工的技术，应用在激光焊接设备、金属加工设备、光学等方向，能够解决质量加工精度无法获得等问题

Inactive Publication Date: 2008-05-07
JAPAN DISPLAY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If chips are generated and attached to the outer periphery of the machining area, neither the desired quality nor the desired machining accuracy can be obtained

Method used

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  • Laser processing
  • Laser processing
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Embodiment Construction

[0036] A first embodiment of the present invention will be described with reference to FIGS. 2 to 8 . According to a first embodiment of the present invention, a laser device for ablation includes a laser light source and an optical system that optically projects a laser beam irradiated from the laser light source onto a material surface in a predetermined pattern.

[0037] FIG. 2 is a diagram showing an example of a schematic configuration of a laser processing apparatus according to a first embodiment of the present invention. Laser processing device 15 shown in Figure 2 comprises laser light source 1, beam shaper 3, mask or variable window portion 4, projection lens 5, workbench 6, decompression chamber 11 (or laser processing head), exhaust device 12 (such as a collar pump (ruffing pump)) and a gas introduction device 13, and ablate the surface of the material 7.

[0038] Examples of laser light sources include excimer lasers. Excimer lasers have various types according ...

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PUM

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Abstract

Disclosed is a laser processing device. The laser processing device includes a laser beam source irradiating a laser beam, and a laser processing head. The laser processing head includes a transmitting window through which the laser beam passes, an aperture formed in a bottom of the laser head and allowing the laser beam to pass through via the transmitting window, an introducing hole introducing a gas into the laser processing head, and an exhausting hole discharging a gas in the laser processing head to outside. The laser processing head further includes a air hole introducing the gas to the periphery of the laser irradiating area, an air hole allowing to discharge the ambient gas of the laser irradiating area, and a masking shield having an opening placed between the transmitting window and the aperture, and an aerating portion communicated with the introducing hole and exhausting hole.

Description

technical field [0001] The present invention relates to a technique for patterning a resin film or a metal thin film on a multilayer film such as a FPD (Flat Panel Display). In particular, the present invention relates to a laser processing device, a laser processing head, and a laser processing method for cleaning and collecting materials that are ablated, thermally fused, or both when the surface of a material is irradiated with laser light. Material flakes or debris resulting from laser processing during interaction. [0002] This application claims priority from Japanese Patent Application JP2007-299526 filed on November 11, 2006, the entire contents of which are incorporated herein by reference. Background technique [0003] The recent competition to develop and improve low-cost high-precision flat panel displays (FPDs) has accelerated the manufacture of higher-quality and high-throughput FPDs. [0004] FDP display panels are generally fabricated by photolithography. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/14B23K26/36B23K26/40B23K26/08G02F1/1333B23K26/00B23K26/16
CPCB23K26/1476B23K26/1405B23K26/16B23K26/142B23K26/14B23K26/346
Inventor 佐佐木良成阿苏幸成村瀬英寿山田尚树
Owner JAPAN DISPLAY INC