Luminous chip encapsulation body and light source component
A technology of light-emitting chips and light source components, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of increased cost and large volume, and achieve the effect of improving heat dissipation efficiency and increasing heat dissipation efficiency
Inactive Publication Date: 2008-06-25
CHIPMOS TECH INC
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[0029] FIG. 1A is a cross-sectional view of a light-emitting chip package according to an embodiment of the present invention, and FIG. 1B is a top view of the light-emitting chip package in FIG. 1A , with some components omitted. Figure 1C It is a cross-sectional view of the heat dissipation cover of the light-emitting chip package in FIG. 1A . Please refer to FIG. 1A and FIG. 1B , the light-emitting chip package 100 of this embodiment includes a carrier 110 , at least one light-emitting chip 120 , and a heat dissipation cover 130 . Wherein, the carrier 110 has a plurality of through holes 110a, and the light-emitting chip 120 is disposed on the carrier 110, wherein the light-emitting chip has an active surface 120a, a back surface 120b opposite to the active surface 120a, and a plurality of bumps 122, wherein the The block 122 is disposed on the active surface 120 a of the light emitting chip 120 , and the light emitting chip 120 is electrically connected to the carrier 110 ...
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The invention discloses a light emitting chip packaging body, which comprises a load-bearing device, at least a light emitting chip and a heat radiating cover; wherein, the load-bearing device is provided with a plurality of through holes. The light emitting chip is arranged on the load-bearing device, wherein, the light emitting chip is provided with a driving surface, a back surface opposite to the driving surface and a plurality of convex blocks. The convex blocks are arranged on the driving surface, and the light emitting chip is electrically connected with the load-bearing device through the convex blocks. The heat radiating cover is arranged on the load-bearing device and exposed on at least one side surface of the light emitting chip, the heat radiating cover comprises a cover body and a plurality of convex parts, wherein the convex parts are connected with the cover body, a part of the cover body is positioned on the back surface of the light emitting chip, and the convex parts are respectively penetrated through the through hole, thereore, the light emitting chip packaging body has better heat radiation efficiency.
Description
technical field [0001] The present invention relates to a light source component and a chip package, and in particular to a light source component and a light emitting chip package. Background technique [0002] In recent years, light emitting diode (LED) devices using gallium nitride-containing compound semiconductors, such as gallium nitride (GaN), aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), etc., have attracted much attention. . Group III nitrides are materials with a wide band energy gap, and their emission wavelengths can cover from ultraviolet light to red light, so it can be said to almost cover the entire visible light band. In addition, compared with traditional light bulbs, light-emitting diodes have absolute advantages, such as small size, long life, low voltage / current drive, not easy to break, mercury-free (no pollution problem), and good luminous efficiency (power saving), etc., Therefore, light-emitting diodes are widely used in industr...
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IPC IPC(8): H01L33/00H01L25/00H01L23/367H01L23/02H01L33/48H01L33/64
CPCH01L2224/16225H01L2224/73204H01L2224/73253
Inventor 刘孟学潘玉堂
Owner CHIPMOS TECH INC