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Paste printer and method of printing with paste

A printing machine and solder paste technology, which is applied in the directions of printed circuits, printed circuit manufacturing, and assembling printed circuits with electrical components, which can solve the problems of printed circuit boards not becoming products and damage to fine conductive patterns.

Inactive Publication Date: 2008-06-25
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such contact of the polishing unit causes separation of the protective film from the surface of the printed wiring board, damage to fine conductive patterns on the surface of the printed wiring board, etc., because the protective film and the fine conductive patterns are formed on the conductive pads on the surface of the printed wiring board. at a location other than
In this way, the printed circuit board cannot be a product

Method used

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  • Paste printer and method of printing with paste
  • Paste printer and method of printing with paste
  • Paste printer and method of printing with paste

Examples

Experimental program
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Embodiment Construction

[0036] Fig. 1 schematically illustrates a solder paste printer 11 according to a first embodiment of the present invention. The solder paste printer 11 includes a stage 12 . The stand 12 is designed to support a printed wiring board, not shown. In this case, the stand 12 has a plate structure. The plate type allows the plate material to support the printed wiring board on the surface of the plate material. Alternatively, the stand 12 may also have a pin-type structure. The pin style allows the pin to support the printed wiring board on the tip of the pin.

[0037] The solder paste printer 11 includes a masking member that is opposed to the stage 12 , that is, a metal mask 13 . Metal mask 13 defines one or more openings 14 . Each opening 14 is used to expose a conductive pad on the printed wiring board as described below. The opening 14 is patterned into the outline shape of the conductive pad. The metal mask 13 can be made of, for example, a stainless steel plate. Meta...

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PUM

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Abstract

A paste printer allows an electrically-conductive pad formed on a board to be exposed in an opening of a masking member. A removal mechanism is allowed to act on the surface of the electrically-conductive pad within the opening. A rust film is removed from the surface of the electrically-conductive pad. The surface of the electrically-conductive pad gets cleaned. Since the electrically-conductive pad is exposed within the opening of the masking member, the removal mechanism is applied only to the electrically-conductive pad. This results in prevention of damages to the board over an area outside the electrically-conductive pad. In addition, the squeegee serves to supply the electrically-conductive paste to the surface of the electrically-conductive pad through the opening of the masking member. The electrically-conductive pad is covered with the electrically-conductive paste. This results in a reliable prevention of oxidation on the surface of the electrically-conductive pad.

Description

technical field [0001] The present invention relates to a solder paste printer designed to apply conductive solder paste to conductive pads defined on printed wiring boards. Background technique [0002] For example, Japanese Patent Application Laid-Open No. 10-79569 discloses a component mounting apparatus. The printed wiring board is supplied to the component mounting equipment. Conductive pads are formed on the surface of the printed wiring board. The surface of the conductive pad is polished prior to mounting one or more components. A polishing unit is utilized. The oxide film is removed from the surface of each conductive pad. Clean the surface of the conductive pad. With sufficient humidity, the solder paste is allowed to spread over the conductive pads. [0003] The polishing unit is designed to be in contact with the entire surface of the printed wiring board. This causes the oxide film to be removed from the surface of the conductive pad. However, such conta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/3484H01L21/6715H05K2203/0257H05K2203/095H05K2203/0285H05K3/3489H05K2203/082H05K3/1233H01L21/67017H05K3/3485
Inventor 石川铁二平野慎
Owner FUJITSU LTD