Method and apparatus for measuring wafer surface flatness

A technology of surface flatness and measurement method, which is applied in measurement devices, optical devices, photolithographic process exposure devices, etc., can solve problems such as complicated calculation methods, and achieve the effect of simple operation and easy implementation.

Active Publication Date: 2008-10-01
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology

This method puts special requirements on the exposu

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  • Method and apparatus for measuring wafer surface flatness
  • Method and apparatus for measuring wafer surface flatness
  • Method and apparatus for measuring wafer surface flatness

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[0018] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0019] figure 1 It is a schematic diagram of a lithography apparatus according to a preferred embodiment of the present invention. The apparatus includes: an illumination light source 1 generates and transmits electromagnetic energy, and irradiates the reticle 2 held by the mask stage 3 . Through the objective lens 4, the circuit pattern on the reticle 2 is imaged in the photoresist on the upper surface of the wafer 5, and the workpiece table 6 clamps and drives the wafer 5 to complete horizontal and vertical movement. After the exposed wafer 5 is chemically treated, the pattern on the reticle 2 is transferred to the photoresist on the surface of the wafer 5 . The mask stage motion controller 7 manipulates the three-dimensional movement of the mask stage 3, the workpiece stage vertical controller 8 is used to control the vertical position of ...

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Abstract

The present invention provides a method and device of measuring the smoothness of the wafer surface, measuring the morphology value of the different positions of the wafer surface by virtue of the redundancy of the workpiece stage vertical location device in an exposure device, acquiring the smoothness of the any point of the wafer surface by polynomial fitting calculation. The invention completes on line directly based on the lithography exposure device, having simple operation, easy to implement.

Description

technical field [0001] The invention relates to a measuring device for photolithographic equipment, in particular to a flatness measuring device and a measuring method for photolithographic equipment. Background technique [0002] Photolithography, or photolithography, has been widely used in integrated circuit manufacturing processes. This technology exposes through a photolithography system to transfer the designed mask pattern to the photoresist. The concepts of "mask" and "photoresist" are well known in the photolithography process: a mask is also called a photomask plate, which is a substrate with various functional patterns that are precisely positioned on a substrate such as a film, plastic or glass. A template used for selective exposure of the photoresist layer; photoresist is a colloidal liquid mixed with photosensitive compounds, matrix resins and organic solvents, and its chemical structure changes after being exposed to light of a specific wavelength , so that...

Claims

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Application Information

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IPC IPC(8): G03F7/20G01B11/30
Inventor 毛方林
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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