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Photovoltaic element, backlight module apparatus and illumination device

A technology of photoelectric components and electrodes, applied in lighting devices, components of lighting devices, electrical components, etc., can solve problems such as voltage instability, current congestion, and inability to fully combine

Active Publication Date: 2012-08-29
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the design of the auxiliary electrodes uses eutectic bonding technology during packaging, there will often be a phenomenon that they cannot be completely bonded, thus causing problems such as current crowding and voltage instability.
If wire bonding technology is used, multiple wire bonding steps are required, increasing the complexity of the package

Method used

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  • Photovoltaic element, backlight module apparatus and illumination device
  • Photovoltaic element, backlight module apparatus and illumination device
  • Photovoltaic element, backlight module apparatus and illumination device

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Embodiment Construction

[0037] The invention discloses a light emitting diode tube core and a manufacturing method thereof. In order to make the narration of the present invention more detailed and complete, refer to the following description and cooperate Figure 1 to Figure 14 icon of the .

[0038] Please refer to figure 1 To illustrate the embodiments provided by the present invention. figure 1 The epitaxial structure of the LED die shown includes a stack of opaque substrates 24, the material of which is, for example, n-type gallium arsenide (GaAs), an etching stop layer (Etching Stop Layer) 22, a lower cladding layer (Lower Cladding Layer) ) 20, the material of which is, for example, n-type aluminum gallium indium phosphide (n-type (Al X Ga 1-X ) 0.5 In 0.5 P), active layer (Active Layer) 18, its material is aluminum gallium indium phosphide ((Al X Ga 1-X ) 0.5 In 0.5 P), upper cladding layer (Upper CladdingLayer) 16, its material is p-type aluminum gallium indium phosphide (p type-(...

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PUM

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Abstract

The invention discloses a photoelectrical element, especially a photoelectrical element of a LED (light emitting diode). The LED comprises a substrate. The substrate is disposed with a plurality of epitaxial layer structures, comprising a conductive semiconductor layer, an active layer and a second conductive semiconductor layer. The epitaxial layer structures are disposed with a first ohm contact metal electrode layer, a second ohm contact metal electrode layer, a first nail electrode and a second nail electrode; the two nail electrodes are disposed on the same horizontal plane. Furthermore,the first ohm contact metal electrode has pattern for uniformly dispersing current to the whole tube core. The invention also discloses a backlight module and illuminating device comprising the photoelectrical element.

Description

technical field [0001] The invention relates to a photoelectric element, in particular to a photoelectric element of a light-emitting diode tube core. Background technique [0002] Light-emitting diode is a widely used light source in optoelectronic components. Compared with traditional incandescent bulbs or fluorescent tubes, light-emitting diodes have the characteristics of energy saving and long service life, so they gradually replace traditional light sources and are used in various fields, such as traffic signal signs, backlight modules, street lighting, medical equipment Wait. [0003] As the luminous efficiency of components increases and the circuit design becomes simpler due to modularization, the die size of LEDs tends to increase. When the size of the light-emitting diode die becomes larger, the current input through the electrodes is relatively larger under the operation of a fixed current density. Auxiliary electrodes, such as Figure 5 shown. However, if th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00G02F1/13357H05B37/00H05B37/02F21V23/00F21Y101/02F21Y115/10H01L33/14H01L33/36
Inventor 林鼎洋欧震赖世国
Owner EPISTAR CORP