Methods and apparatus for fabricating conductive features on glass substrates used in liquid crystal displays

Abstract

Methods and systems for defining metal features to be part of a liquid crystal display (LCD) is provided. The method is applied to a glass substrate, and the glass substrate has a blanket conductive metal layer (e.g., a barrier layer) defined on the glass substrate or a layer of the glass substrate. An inverse photoresist mask is applied over the blanket conductive metal layer. A plating meniscus is then formed over the inverse photoresist mask. The plating meniscus contains at least an electrolytic solution and a plating chemistry, where the plating meniscus forms metal features in regions over the blanket conductive metal layer not covered by the inverse photoresist mask.

Description

technical field [0001] The present invention relates to the fabrication of metallized features in liquid crystal display (LCD) applications. Background technique [0002] Electroplating is a well-established deposition technique. In the field of semiconductor manufacturing, electroplating is usually performed in a single wafer handler, where the wafer is immersed in an electrolyte solution. During electroplating, the wafer is typically placed on a wafer holder, which is at negative or ground potential relative to a positively charged plate (also immersed in the electrolyte) as the anode. To form a copper layer, for example, the electrolyte is typically between about 0.3M and about 0.85M CuSO 4 , pH between about 0 and about 2 (by H 2 SO 4 regulation), and has trace levels (ppm concentration) of proprietary organic additives as well as Cl - , to improve the deposition quality. During the electroplating process, the wafer is typically rotated to facilitate uniform electr...

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The cost of this target is enormous, but a large target is required to perform aluminum sputtering

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