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Electronic element component having compound material base

A technology of electronic components and composite materials, which is applied in the direction of electrical components, semiconductor/solid-state device parts, electric solid-state devices, etc., and can solve problems such as degradation of photoelectric characteristics of chips, poor reliability of chips, and easy local concentration of heat, etc.

Active Publication Date: 2008-10-22
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, the heat accumulation effect of the high current driver chip will affect the light output of the LED
The silver glue used to fix the chip has a low thermal conductivity and cannot provide a proper thermal conduction channel to transfer heat to the metal substrate. Therefore, the heat generated by the chip is easily concentrated locally and cannot be dissipated, thereby deteriorating the photoelectric characteristics of the chip, causing Chip reliability is not good

Method used

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  • Electronic element component having compound material base
  • Electronic element component having compound material base
  • Electronic element component having compound material base

Examples

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Embodiment Construction

[0032] Embodiments of the present invention are described below with reference to the accompanying drawings.

[0033] figure 1The meanings of the reference signs are as follows: 10 indicates the electronic component assembly; 11 indicates the composite material carrier; 13 indicates the intermediate layer; 14 indicates the circuit carrier; 15 indicates the circuit; 16 indicates the wire; 17 indicates the electronic component; 18 indicates the connection means . The same elements in other drawings described below will be marked with the same reference numerals, and will not be described again.

[0034] Such as figure 1 As shown, the composite material carrier 11 is connected to the circuit carrier 14 through the intermediate layer 13 , and the circuit 15 is formed on the circuit carrier 14 . The electronic component 17 is fixed on the composite material carrier 11 through the connecting means 18. The connecting means 18 include but not limited to screw fixing, buckling, fric...

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PUM

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Abstract

The invention relates to an electronic element component, which comprises a composite material carrier, a circuit carrier comprising first dielectric materials, a circuit which is formed on the circuit carrier and comprises electric conducting materials, an intermediate layer between the circuit carrier and the composite material carrier, and an electronic element which is arranged on the composite material carrier and electrically connected to the circuit.

Description

technical field [0001] The present invention relates to an electric component assembly, in particular to an electric component assembly with a composite material carrier. Background technique [0002] As light-emitting diodes (Light-Emitting Diodes; LEDs) are widely used, the sizes of bare dies provided by manufacturers are also becoming more and more diverse. When the die size is larger, the light output increases at the same current density; however, as the input current increases, more heat is accumulated in the chip. [0003] The thermal resistance of the traditional 5mm cannonball LED packaging structure is 250°C / W~300°C / W. If the high-power chip adopts the traditional packaging form, it is easy to cause the surface temperature of the chip to rise rapidly due to poor heat dissipation, resulting in carbonization and discoloration of the surrounding epoxy resin. Furthermore, the light attenuation of the monomer is accelerated until failure, and the packaging structure ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L23/488H01L23/498H01L33/00H01L33/48H01L33/64
CPCH01L2224/48091H01L2924/0002H01L2224/73265
Inventor 许嘉良黄建富
Owner EPISTAR CORP