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Combination of cooling device

A technology of heat dissipation device and radiator, which is applied in the directions of elastic/clamping device, cooling/ventilation/heating modification, circuit layout on support structure, etc., which can solve the problem of affecting heat dissipation efficiency, poor contact between radiator and electronic components, The problem of uneven force on the device, to achieve the effect of ensuring stable contact

Inactive Publication Date: 2011-08-31
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the two fasteners are separately arranged on both sides of the radiator, when the two fasteners are subjected to external forces or other reasons and there is a difference, the fastening force applied to both sides of the radiator will change, so that the force on both sides of the radiator will not be large. Even, it will cause the radiator to tilt, resulting in poor contact between the radiator and electronic components, which will affect its heat dissipation efficiency

Method used

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  • Combination of cooling device
  • Combination of cooling device
  • Combination of cooling device

Examples

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Embodiment Construction

[0013] The heat dissipation device combination of the present invention is used to be installed on heat-generating electronic components 44 such as a central processing unit to dissipate heat.

[0014] see figure 1 and figure 2 , shows the heat sink combination of the present invention. The heat sink assembly includes a heat sink 20 and a fastener 30 for fixing the heat sink 20 on the electronic component 44 of the circuit board 40 .

[0015] The heat sink 20 is made of thermally conductive metal materials such as copper and aluminum, and includes a base 21 and a plurality of heat dissipation fins 23 integrally formed and extruded from the base 21, and the heat dissipation fins 23 are arranged in parallel with each other at intervals. A rectangular groove 230 is defined in the center of each cooling fin 23 , and a plurality of rectangular grooves 230 form a receiving portion 25 for placing the buckle 30 . The two heat dissipation fins 23 located in the center of the heat s...

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Abstract

The invention relates to a heat radiating device assembly used for radiating the electronic device installed on a circuit board. The heat radiating device assembly comprises a heat radiator and a buckle used for fixing the heat radiator on the electronic device, a holding part is arranged on the heat radiator, the buckle comprises an elastic abutting part spanned inside the holding part of the heat radiator and held against the heat radiator and bi-linear buckling parts respectively pivoted at both ends of the elastic abutting part and is clipped and buckled with the circuit board. Compared with the prior art, the buckle provided by the heat radiating device assembly can eliminate the effect of the uneven stress of the heat radiator resulted from the difference of the buckle, so that the inclination of the heat radiator is not easy to occur.

Description

technical field [0001] The invention relates to a cooling device combination, in particular to a cooling device combination for cooling electronic components. Background technique [0002] High-power electronic components such as computer central processing unit, north bridge chip, and graphics card will generate a lot of heat during operation. If the heat cannot be effectively dissipated, it will directly lead to a sharp rise in temperature, which will seriously affect the performance of electronic components. normal operation. Therefore, a heat dissipation device is needed to dissipate heat from these electronic components, and a traditional heat dissipation device usually includes a heat sink and a fastener for fixing the heat sink to the electronic components. [0003] When the above-mentioned heat dissipation device is in use, first install the heat sink on the top surface of the electronic component, and then use the buckle between the fastener and related components ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K7/12G06F1/20H01L23/367H01L23/40
CPCH01L2924/0002
Inventor 李冬云
Owner FU ZHUN PRECISION IND SHENZHEN
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