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Method to produce adhesiveless metallized polyimide film

A polyimide film, polyimide technology, applied in printed circuit manufacturing, metal material coating process, liquid chemical plating, etc., can solve the problem of low spatial stability, easy copper migration, differential thermal characteristics and measurability and other issues

Inactive Publication Date: 2008-11-26
林汉邦
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition to meeting the need for thinner metal-polyimide films, the advent of adhesives has further drawbacks such as susceptibility to copper migration, relatively low dimensional stability, poor thermal characteristics, and scalability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] In the preferred test scale process, the PMDA type polyimide membrane (for example, Kapton membrane) with a size of 7.0cm by 1.5cm and a thickness of 75.mu.m was placed under a vacuum pressure of 100Pa in O 2 The plasma is pretreated with 0.5W / cm.sup.2 alternating current for 5 minutes. After the pretreatment, the monomer in the form of 1-vinylimidazole (VIDZ) is quickly introduced into the plasma chamber in the form of vapor by argon, and the vacuum pressure of 100Pa is maintained, and the AC plasma of 0.1W / cm.sup.2 is used. Process for 3 minutes.

[0026] After being removed from the plasma chamber, the polyimide film was first rinsed thoroughly with water and then immersed in a copper electroless plating tank to deposit a thin copper layer with a thickness ranging from 100 nm to 200 nm. (Enthone Inc., a branch of Confident Electronics Co., Ltd., provides a series of electroless plating solutions for galvanized thin steel sheets (Enplate)). The catalyst solution off...

Embodiment 2

[0028] In another preferred embodiment, argon plasma is used instead of O 2 A similar polyimide membrane was pretreated. The pretreated film is then exposed to the atmosphere for at least half an hour to form surface peroxides on its surface. The sample was then returned to the plasma chamber and the same plasma grafting conditions and other subsequent steps as in Example 1 were used. The T-peel strength of the copper film thus obtained exceeded 9 N / cm.

Embodiment 3

[0030] In another preferred embodiment, the same polyimide membrane is directly exposed to O 2 Plasma, and VIDZ monomer is placed in it at the same time, so the initial O can be ignored 2 Plasma pretreatment. This sample was then used for copper electroless plating and electroplating as in Example 1. The T-peel strength of the copper film thus obtained exceeded 9 N / cm.

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PUM

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Abstract

The present invention is directed to a method for the adhesiveless deposition of metal, and especially copper, to the surface of polyimides and derivatives of polyimide. More specifically, the invention is .directed to the method for surface modification of polyimides and derivatives of polyimides by plasma graft co-polymerization with the vapor deposition of an appropriate functional monomer followed by subsequent deposition of metal of interest through a process of electroless and electrolytic plating. The so deposited metal-polyimide interface exhibit a T-peel adhesive strength in excess of 10 N / cm with polyimide films with a thickness of 75 .mu.m.

Description

technical field [0001] The present invention relates to a kind of metallized polyimide film, forms the metal layer (such as copper) that does not need any adhesive on the surface of polyimide film and its manufacturing method, particularly relates to a kind of flexible printed circuit or flexible Metallized polyimide film for wiring board and the like, and method for manufacturing the same. Background technique [0002] As the basic material of microelectronics packaging and sealing industry, polyimide film and its derivatives are very important. Polyimide is a widely used specialty plastic due to its outstanding, high-performance engineering properties and its particular suitability for the microelectronics packaging industry and composite applications. Polyimide has good thermal and mechanical stability, low dielectric constant and chemical resistance. For applications in microelectronics, the adhesion between polyimides and metals, especially copper, is of particular im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/00C08G73/10C23C14/00C23C14/02C23C14/20C23C18/00C23C18/16C23C18/18C23C18/20C23C18/22C23C18/28C23C18/30
CPCC25D5/50H05K2203/1168C23C18/22H05K2203/095H05K1/0346Y10T428/31681H05K3/181C08L79/08C25D5/56H05K2201/0154H05K3/381
Inventor 林汉邦
Owner 林汉邦
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