Preparation method for pure silicon beta molecular sieve film
A technology of molecular sieve and pure silicon, which is applied in the field of pure silicon beta molecular sieve membrane preparation, can solve the problems of long synthesis time and limit the application value of beta molecular sieve membrane, and achieve good repeatability
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Embodiment 1
[0046] A method for preparing a beta molecular sieve membrane with a single crystal silicon wafer (Beijing Institute of Nonferrous Metals) as a carrier.
[0047] Preparation of step 1 seed crystal: the reaction ratio of nano-beta molecular sieve seed crystal solution is: 4.5molNaOH: 25mol SiO 2 (Silica): 9.0mol Tetraethylammonium Hydroxide (TEAOH): 0.5molNaAlO 2 : 360mol H 2 O. Add 3.0 grams of white carbon black to a mixed solution of 5.89 grams, 45%wt tetraethylammonium hydroxide solution, 0.36 grams of sodium hydroxide, 0.082 grams of sodium aluminate, and 9.72 grams of distilled water, and stir until uniform on an electromagnetic stirrer. Then the reaction mixed solution was transferred to the lining of the reaction kettle, the kettle was installed, sealed, and crystallized at 100° C. for 10 days. The product is repeatedly centrifuged, washed with water, and the aqueous solution is neutralized, then dried; dealumination of nano-beta zeolite seed crystals: add 60 g of 60...
Embodiment 2
[0054] A method for preparing a beta molecular sieve membrane using a single crystal silicon chip as a carrier.
[0055] Except that the carrier was dropped into 10g / L seed crystal emulsion to prolong for 12 minutes, the others were the same as in Example 1 to obtain a beta molecular sieve membrane (M2) with a single crystal silicon chip as a carrier, with a thickness of 2.2 microns.
Embodiment 3
[0057] A method for preparing a beta molecular sieve membrane using a single crystal silicon chip as a carrier.
[0058] Except that the seed crystal carrier was laid flat on the bottom of the kettle, the others were the same as in Example 1 to obtain a beta molecular sieve membrane (M3) with a single crystal silicon chip as a carrier, with a thickness of 2.5 microns.
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