Method and device for testing reliability

Abstract

A test method of reliability comprises an element to be tested and a test device, wherein the element to be tested comprises electrodes, and a signal end of a current-voltage unit of the test device is connected with the electrodes of the element to be tested through at least one inducer. Accordingly, the invention further provides the test device of reliability. At least one inducer is connected between the single end of the current-voltage unit of the test device and the electrodes of the element to be tested in series; as the inducer has the delay function when in current mutation, the current-voltage unit has enough time to measure the breakdown current value through delaying the high energy which is stored in the test device to be imposed on the two electrodes of the element to be tested, and the judgment can be made through a procedure, thereby withdrawing from the test in time and further preventing a probe and the electrodes of the element to be tested from being burned.

Description

technical field [0001] The invention relates to a reliability testing method and testing equipment thereof. Background technique [0002] Generally, probes are used to test the electronic properties and circuit functions of semiconductor chips formed on semiconductor wafers. Generally, the test is carried out while the semiconductor chip is still in the form of a wafer, and the probes are placed on the wafer so that the probes are in contact with the corresponding electrodes of the semiconductor devices in the semiconductor chip, thereby achieving The needles test the electrical performance of semiconductor devices on semiconductor chips. [0003] The prior art discloses a probe sheet, a probe card, a semiconductor inspection device, and a method for manufacturing a semiconductor device. The probe card has first contact terminals electrically connected to electrodes of an inspection object formed at a narrow pitch, wiring drawn from the first contact terminals, and second ...

AI Technical Summary

Problems solved by technology

Since the current voltage unit (SMU) measures the current value of the entire loop and the software compares the measured current value with the standard capacitor breakdown current value, it takes a certain amount of time. At the moment of capacitor breakdown, the current suddenly changes to a very high level. At this time, the circuit appears an instant short-circuit state. Although the current value is greater than the breakdown current value of the standard capacitor at this time, the test will not be terminated immediately because the current and voltage unit has not yet reflected the current value at this time. Because the test head of the entire test equipment is equivalent to a For a very large capacitor, the large energy (upper limit is 14W) accumulated in the test equipment at this time will be applied to both ends of the capacitor under test, causing the electrodes of the capacitor and the tip of the probe to be burned. Experiments have proved that energy greater than 2W can Probe burnt

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