Substrate processing apparatus, load-lock chamber unit, and method of carrying out a transfer device

Abstract

Provided is a substrate processing apparatus (1) in which a conveying device in a conveying chamber can be carried out of the substrate processing apparatus regardless of the height of an installation place. The substrate processing apparatus comprises processing chamber (10a-10c) for performing predetermined processing on a substrate s in vacuum, a conveying chamber 20 coupled with the processing chamber and provided with the conveying device 50 for conveying the substrate s while being held in vacuum, and a load lock chamber 30 provided between the conveying chamber 20 and a substrate container on the atmosphere side, wherein a space exists under the load lock chamber 30. The conveying device can be divided into an upper structure and a lower structure 500B, wherein the upper structure can be carried out of the substrate processing apparatus from above the conveying chamber 20, and the lower structure 500B can be carried out of the apparatus from the underside of the conveying chamber 20 through the space under the load lock chamber 30.

Description

[0001] (This case is a divisional application of a patent application with the application number 200610100585.X and the title of the invention is a substrate processing device, a load lock chamber unit, and a method for unloading a transfer device) technical field [0002] The present invention relates to a substrate processing apparatus for processing a large substrate such as a glass substrate for a flat panel display (FPD), a load lock chamber unit, and a transfer method for a transfer device. Background technique [0003] In the manufacturing process of a flat panel display (FPD) represented by a liquid crystal display (LCD), a plurality of vacuum processing devices including etching, ashing, film formation, etc. multi-chamber vacuum processing system. [0004] For such a vacuum processing system, it includes: a transfer chamber provided with a transfer device for transferring substrates and a plurality of processing chambers arranged around it, and a transfer arm in th...

AI Technical Summary

Problems solved by technology

[0008] It is considered that these mechanisms should be avoided, and the cover at the bottom of the load lock chamber should be made into a rotating type. However, in the case of "single opening" with one end as the rotation axis, the cover cannot be fully opened, and sufficient protection cannot be ensured. Maintenance space, and in the case of "double opening", the open cover will hinder the maintenance access and deteriorate the operability

Images