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Lithographic apparatus and device manufacturing method

A lithography equipment and lithography technology, which can be used in microlithography exposure equipment, semiconductor/solid-state device manufacturing, optomechanical equipment, etc., and can solve problems such as substrate waste

Inactive Publication Date: 2012-05-23
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

All useful devices are not formed from edge devices, so this part of the substrate is wasted

Method used

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  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method
  • Lithographic apparatus and device manufacturing method

Examples

Experimental program
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Embodiment Construction

[0024] figure 1 A lithographic apparatus 50 according to an embodiment of the invention is schematically shown. The apparatus comprises a first lithographic apparatus 70 and a second lithographic apparatus 60 . The first lithography apparatus 70 includes:

[0025] - an illumination system (illuminator) IL configured to condition a radiation beam B (eg, ultraviolet (UV) radiation or deep ultraviolet (DUV) radiation);

[0026] - a support structure (eg mask table) MT configured to support the patterning device (eg mask) MA and connected to first positioning means PM configured to precisely position the patterning device according to determined parameters;

[0027] - Substrate table (eg wafer table) WT a , configured to hold a substrate (e.g., a resist-coated wafer) W, and configured with a second positioning device PW configured to precisely position the substrate according to determined parameters a connected; and

[0028] - a projection system (e.g. a refractive projectio...

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PUM

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Abstract

A lithographic apparatus and a method are disclosed to reduce the exposure time that a substrate spends within a main lithographic apparatus by pre- (or post-) exposing one or more edge devices on the substrate. Because an edge device does not ultimately yield a useful device, it can be exposed with a first lithographic device that has a lower resolution than a second lithographic device used to expose one or more of the other, complete devices produced from the substrate. Therefore, the pre- (or post-) exposure of an edge device can be performed using a lower complex, and lower cost, lithographic device.

Description

technical field [0001] The present invention relates to a lithographic apparatus and a method of manufacturing devices using lithographic techniques. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or more devices) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred via imaging to a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a network of adjacent target portions that are continuously patterned. Known lithograp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/027
CPCG03F7/7045G03F7/70991G03F7/70425G03F7/70466G03F7/70733
Inventor 朱德克斯·玛丽·多米尼克斯·斯多尔德瑞杰埃瑞克·罗洛夫·鲁普斯卓简·伯纳德·普莱彻尔墨斯·范斯库特蒂德瑞克·简·马阿斯
Owner ASML NETHERLANDS BV