Fingerprint sensing chip with flexible circuit board signal transmission structure and manufacturing method thereof
A flexible circuit board and signal transmission technology, which is applied in the direction of circuit, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of chip damage, insufficient insulation layer thickness, and chip antistatic ability limitation
Inactive Publication Date: 2009-02-25
EGIS TECH
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Problems solved by technology
In addition, the thickness of the insulating layer formed by the thin film manufacturing process is usually too thin to produce the effect of finger abrasion resistance
[0004] Furthermore, when a finger with static electricity is close to the chip, it is easy to generate an electrostatic discharge effect on the surface of the chip and destroy the chip.
The reason is that the thickness of the insulating layer is insufficient, which limits the antistatic ability of the chip
Method used
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[0030] In order to make the above-mentioned content of the present invention more comprehensible, a preferred embodiment is specifically cited below, together with the accompanying drawings, and described in detail as follows.
[0031] Chip-on-film (COF) is a technology for flip chip bonding (Flip Chip Bonding) on a flexible printed circuit board (Flexible Printed Circuit board, FPC) substrate. This technology is widely used in IC packaging. For example, the packaging of liquid crystal display panels (Liquid Crystal Panel) and related driver ICs is completed by using COF, which saves the traditional printed circuit board, achieves the purpose of being lighter, thinner, shorter and flexible. characteristics.
[0032] In the process of seeking to improve the pressure impact resistance, finger wear resistance and static electricity damage resistance of the fingerprint sensing chip, the inventors of this case found that the COF technology can be applied to the fingerprint sensin...
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The invention provides a fingerprint sensing chip with a flexible circuit board signal transmission structure. The chip comprises a substrate, a plurality of first connection pads and a flexible circuit board. The substrate is provided with a plurality of fingerprint sensing units. The first connection pads are respectively arranged on the finger sensing unit and exposed out of the upper surface of the substrate. The flexible circuit board is positioned above the substrate and provided with a plurality of signal transmission structures exposed from a lower surface of the flexible circuit board. The fingerprint sensing units are respectively in electrical connection with the signal transmission structures. The upper surface of the flexible circuit board used as the surface contacting with a finger transmits a plurality of fingerprint signals measuring the finger to the fingerprint sensing unit through the signal transmission structures. The invention further provides a method for manufacturing the fingerprint sensing chip.
Description
technical field [0001] The invention relates to a fingerprint sensing chip, in particular to a fingerprint sensing chip with a flexible circuit board signal transmission structure and a manufacturing method thereof. Background technique [0002] Most of the current non-optical fingerprint sensors are designed and manufactured on the sensing structure of the silicon chip. An array of sensing units is fabricated on top of the chip for direct contact with the finger to measure the image contrast between the peaks and valleys of the fingerprint. Involving these fingerprint sensing chip technologies, you can refer to the following related patents proposed by the inventor of this case: (a) Chinese invention patent application number 02105960.8, the application date is April 10, 2002, and the invention name is "capacitive Fingerprint Reading Chip", Publication No. 1450489; (b) Chinese Invention Patent Application No. 02123058.7, filed on June 13, 2002, and the title of the inventi...
Claims
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Login to View More IPC IPC(8): H01L23/488H01L23/498H01L21/60G06K9/00
Inventor 周正三
Owner EGIS TECH