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Method for processing resistance welding milling point

A technology of spot treatment and solder resistance, applied in the field of circuit board production technology, can solve the problem of high cost of resin plug holes, achieve the effect of reducing production cost and ensuring quality

Inactive Publication Date: 2011-02-16
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the production process of circuit boards in the prior art, especially in the production process of multi-layer circuit boards, resin plugging is used, but the cost of resin plugging is relatively expensive, and special grinding machines, special screen printing machines and Resin ink, etc., is difficult for general PCB manufacturers to accept

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  • Method for processing resistance welding milling point
  • Method for processing resistance welding milling point
  • Method for processing resistance welding milling point

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Experimental program
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Embodiment Construction

[0023] The pre-treatment process of the circuit board is carried out first, which is used to clean the oil stains and oxide layers on the circuit board, and a volcanic ash grinder can be used to deoxidize the surface of the board and the inside of the hole.

[0024] Then stick the aluminum sheet to the screen, and stick the polished aluminum sheet to the screen with a universal glue to increase the tension of the plugged aluminum screen to meet the uniform ink penetration of the plugged hole. Add an air guide plate to discharge the air in the plugged hole, so as to achieve the fullness of the ink in the plugged hole. Complete the plug hole treatment.

[0025] Green oil on the surface of white screen printing: 36T silk screen printing can be used for printing, mainly to flatten the ink that is higher than the edge of the plugged hole to ensure the problem of sticking film that may be caused by too thick ink on the edge of the hole during alignment.

[0026] Then carry out doub...

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PUM

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Abstract

The invention discloses a method for processing soldering-resistance milling points, comprising the steps as follows: cleaning disposal on the circuit board is carried out; an aluminum sheet which is specially used for a plug hole is bonded to a screen and an air guiding cushion plate is added so as to plug the hole; a white net is used for printing the surface soldering-resistance to the circuitboard after oil plugging; hole-exposure point disposal and development is carried out on both surfaces of the circuit board; and a nonwoven milling brush is used to carry out the milling plate disposal. The method for processing the soldering-resistance milling points reduces the production cost and ensures the quality of the PCB plate production as the nonwoven cloth is adopted for carrying out the milling plate disposal.

Description

technical field [0001] The invention relates to a production process of a circuit board, in particular to a method for manufacturing a circuit board production process that requires both solder-resisting plug holes and via holes that need to be opened. Background technique [0002] With the rapid development of the electronics industry, it is necessary to require the PCB board to develop in the direction of lightness, smallness, and thinness to meet the requirements of highly integrated circuits, and it is necessary to solder components on the wiring holes or increase test points to reduce the number of soldered components. Or the PCB board area occupied by the test point. However, the via hole can only be used as a connection between the power supply and the signal layer. If components are soldered on the via hole, higher requirements will be placed on the plug hole of the via hole, that is, to meet the fullness of the plug hole, It is also necessary to ensure that there i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22
Inventor 王中前
Owner SHENZHEN SUNTAK MULTILAYER PCB