Unlock instant, AI-driven research and patent intelligence for your innovation.

Adhesive chuck and substrate bonding apparatus

A sticky chuck and bonding equipment technology, applied in adhesives, nonlinear optics, chemical instruments and methods, etc., can solve the problems of expensive LCD manufacturing and unreliable operation

Inactive Publication Date: 2010-11-17
ADVANCED DISPLAY PROCESS ENG CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, problems have arisen during the process of attaching the substrates that make LCDs expensive to manufacture or unreliable to operate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive chuck and substrate bonding apparatus
  • Adhesive chuck and substrate bonding apparatus
  • Adhesive chuck and substrate bonding apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] A liquid crystal display (LCD) can be formed by bonding a TFT substrate and a CF substrate together. Liquid crystal material is then injected between the substrates. This bonding process is one of the most important processes for determining the quality of an LCD, and is usually performed by equipment with a vacuum chamber.

[0011] One type of bonding equipment includes electrostatic chucks (ESC) arranged opposite each other in a chamber for holding respective substrates. The device operates by bringing electrostatic chucks closer together while precisely maintaining the parallelism of the chucks. The bonding process is performed with the chuck in these positions.

[0012] The electrostatic chuck used to support the substrate was fabricated to include a metal pattern on a polyimide film. The use of such chucks increases costs. Also, the polyimide film coated on the surface of each chuck may be damaged by particles generated during the substrate attaching process. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.

Description

technical field [0001] One or more embodiments described herein relate to the use of adhesive chucks in substrate bonding. Background technique [0002] A liquid crystal display (LCD) may be formed by injecting liquid crystal between a color filter (CF) substrate coated with a fluorescent material and a thin film transistor (TFT) substrate. A sealer can be applied to the surrounding surface of the substrate to prevent leakage. Before sealing, a spacer can be placed between the substrates to maintain a gap between the substrates. However, problems have arisen during the process of attaching the substrates that make LCDs expensive to manufacture or unreliable to operate. Contents of the invention [0003] According to one aspect of the present invention, a substrate bonding apparatus is disclosed, comprising: a first chamber including a first surface plate on which a first substrate is supported; a second chamber separated from the first chamber, comprising a second surfa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1341G02F1/1333
CPCB32B37/12B32B38/1833B32B38/18B32B2038/1891B32B2457/202B32B38/1858G02F2202/28B32B2309/68B32B37/0046G02F2001/133354G02F1/1303Y10T156/1702Y10T156/1744Y10T156/19Y10T156/17G02F1/133354G02F1/13
Inventor 黄载锡
Owner ADVANCED DISPLAY PROCESS ENG CO LTD