Method of manufacturing printed circuit board and printed circuit board manufactured by the same

Abstract

A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger; forming a first insulating layer on the metal layer by primarily anodizing the metal layer; electroplating a surface of the bonding finger by supplying power to the metal layer; and forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer. A gold electroplating process can be performed without a lead wire, and an oxide layer formed by an anodizing process can protect circuits formed on the substrate and electrically insulate them.

Description

technical field [0001] The present invention relates to a method of manufacturing a printed circuit board (PCB) and a PCB manufactured by the method, and more particularly, to a method of manufacturing a PCB and a PCB manufactured by the method, in which method, using The anodizing process forms an oxide layer for protecting circuit patterns formed on the substrate. Background technique [0002] In recent years, as electronic appliances are reduced in size and their functions are more complex, a multi-chip package (MCP) or a stacked chip-scale package in which integrated circuit (IC) chips are stacked is being widely used. IC package substrates for MCP or Stacked Chip Scale Package must have a predetermined thickness or less so that MPC or Stacked Chip Scale Package can be applied to small-sized electronic appliances with complex functions. [0003] A conventional method of manufacturing a printed circuit board (PCB) must include a process of coating a solder resist to prev...

AI Technical Summary

Problems solved by technology

[0008] However, manufacturing a conventional PCB is complicated and costly since gold-plated leads must be formed to plate the bonding fingers 2a with gold

[0009] In addition, traditional solder resist has high moisture absorption rate and high thermal expansion coefficient, so traditional PCB cannot guarantee high reliability

[0010] In addition, when the substrate 1 has a very small thickness, it is also necessary to attach a stiffener on the substrate 1, so that it is difficult to move or handle the PCB during the time interval between process steps during the package assembly process

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