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Printed circuit board and manufacturing method thereof

A printed circuit board, circuit pattern technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problem of low adhesion of copper foil layer and so on

Inactive Publication Date: 2009-04-29
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the commercial method of interconnection using conductive paste results in higher resistivity and lower adhesion to the copper foil layer compared to the method of interconnection using copper plating

Method used

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  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof

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Embodiment Construction

[0016] Hereinafter, printed circuit boards and methods of manufacturing the same according to some embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Regardless of the figure number, the same or corresponding parts are denoted by the same reference numerals, and redundant explanations are omitted.

[0017] figure 1 is a flowchart of a method of manufacturing a printed circuit board according to an embodiment of the present invention, and Figure 2 to Figure 6 is a cross-sectional view showing a flowchart of a method of manufacturing a printed circuit board according to an embodiment of the present invention. exist Figure 2 to Figure 6 In , a first metal layer 21 , a bump 22 , an insulating layer 23 , a second metal layer 24 , a circuit pattern 25 , and an alloy layer 26 are shown.

[0018] Operation S11 may include: forming a bump on the first metal layer from a paste including silver powder, silver flake, and...

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Abstract

A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board may include: an insulation layer, a circuit pattern formed on an upper surface and a lower surface of the insulation layer, and a bump penetrating the insulation layer such that the circuit pattern is electrically connected, where an alloy layer, which is configured to increase contact between the circuit pattern and the bump, may be interposed between the bump and the circuit pattern.

Description

[0001] Related Application Cross Reference [0002] This application claims the benefit of Korean Patent Application No. 10-2007-0108384 filed with the Korean Intellectual Property Office on October 26, 2007, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to a printed circuit board utilizing bumps, and to a method of manufacturing the printed circuit board. Background technique [0004] With the development of electronic components, there is an increasing need for technology that can improve the performance of HDI (High Density Interconnect) boards, which use interlayer electrical connections of circuit patterns and precisely arranged circuit wiring to provide higher density printed circuit boards . That is, in order to improve the performance of HDI boards, improved techniques for interlayer electrical connection of circuit patterns and techniques that provide a higher degree of freedom in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/40
CPCH05K2203/1461H05K3/4647H05K2203/1189H05K2201/0355H05K3/4069Y10T29/49156H05K1/11
Inventor 睦智秀柳济光李应硕柳彰燮
Owner SAMSUNG ELECTRO MECHANICS CO LTD