Grinding process technique of high-density interconnect circuit board plug socket resin

Abstract

The invention relates to a process for grinding plug hole resins of a high-density interconnected circuit board, which comprises the following process steps: laying out a board; grinding the upper surface of the high-density interconnected circuit board for the first time by an abrasive belt grinding machine; grinding the lower surface of the high-density interconnected circuit board for the first time by the abrasive belt grinding machine; washing the board surface by using water; grinding the upper surface of the high-density interconnected circuit board for the second time by the abrasive belt grinding machine; grinding the lower surface of the high-density interconnected circuit board for the second time by the abrasive belt grinding machine; washing the board surface with water; highly cutting a six-spindle nonwoven fabric brush grinding machine, drying the board surface after washing the board surface with water, retracting the board automatically and the like. The method has the advantages of high yield capacity, low production cost, easily controlled quality, small error and the like.

Description

technical field [0001] The invention relates to a high-density interconnection circuit board plug hole resin grinding process, in particular to a high-density interconnection circuit board for removing surface plug hole resin. Background technique [0002] High-density interconnection circuit boards (referred to as HDI PCBs in English) are widely used. With the trend of thinner and smaller electronic products, the wiring density requirements of high-density interconnection circuit boards are getting higher and higher, and the application fields of high-density interconnection circuit boards are also increasing. Wide, such as: mobile phones, digital cameras, digital video cameras, MP3, MP4, Bluetooth headsets, GPS and car DVD, etc., high-density interconnection circuit boards have become key components of these consumer electronics. [0003] The method of removing plugging resin on the surface of the high-density interconnection circuit board is to use a fully automatic abras...

AI Technical Summary

Problems solved by technology

[0008] 3. The quality is not easy to control, because the parameters of the grinding cannot be fixed, resulting in the surface copper thickness being thin and sometimes thick, and the surface copper thickness is a very critical parameter of high-density interconnection circuit boards. If it is unstable, it will lead to high-density interconnection circuit boards. quality risks;

[0009] 4. Unfixed grinding times lead to instability in the size of high-density interconnected circuit boards, causing production troubles in subsequent processes, wasting film and reducing production efficiency;

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