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Radiating device and hot pipe thereof

A heat dissipation device and heat pipe technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of increasing the cost of heat dissipation devices, and achieve the effect of increasing heat dissipation efficiency and reducing costs

Inactive Publication Date: 2012-03-14
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in order to improve the heat dissipation efficiency and dissipate the heat generated by the heating electronic components in time, it is often necessary to increase the number of heat pipes, which also leads to an increase in the cost of the heat dissipation device, so it needs to be improved

Method used

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  • Radiating device and hot pipe thereof
  • Radiating device and hot pipe thereof
  • Radiating device and hot pipe thereof

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Embodiment Construction

[0013] Further description will be made below in conjunction with the embodiments with reference to the accompanying drawings.

[0014] Fig. 1 shows the three-dimensional assembly diagram of the heat dissipation device in a preferred embodiment of the present invention, the heat dissipation device includes a heat sink 10, a vapor chamber 20 for thermal contact with a heat generating electronic component (not shown) and A heat pipe 30 transfers heat from the vapor chamber 20 to the radiator 10 .

[0015] Referring to FIG. 2 and FIG. 3 , the heat sink 10 is roughly bowl-shaped, and includes a base plate 11 and a cooling fin set 12 located on the base plate 11 .

[0016] The substrate 11 is in the shape of a circular plate made of thermally conductive material, such as aluminum or copper. The base plate 11 has a bottom surface 112 , and the bottom surface 112 is provided with a semicircular receiving groove 114 for receiving the heat pipe 30 .

[0017] The cooling fin group 12 ...

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Abstract

Disclosed is a heat-dissipating device, which comprises a heat dissipater and a heat pipe connected with the heat dissipater; wherein, the heat pipe includes a heat-absorbing section, two heat-dissipating sections, and two connecting sections respectively connecting the heat-absorbing section and the corresponding heat-dissipating sections; the two opposite ends of the heat-absorbing respectively extend upward to form the two connecting sections; and the two heat-dissipating sections both have the arc shape and form a circular arc shape together to be connected with the heat dissipater. The two heat-dissipating sections are formed in a semi-circle shape by the free ends of the corresponding connecting sections along the same clock direction. The heat-dissipating device can increase the heat-dissipating ratio thereof without increasing the number of the heat pipes, so as to reduce the cost thereof.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a heat pipe. Background technique [0002] With the rapid development of the electronic industry, the high-speed, high-frequency and integration of electronic components make the calorific value increase dramatically. Therefore, heat dissipation has become a key issue for the industry. [0003] In the field of heat dissipation, the industry usually adopts a heat dissipation device to dissipate heat from electronic components. The heat dissipation device includes a substrate, a plurality of heat dissipation fins and a plurality of U-shaped heat pipes arranged on the substrate. The substrate is in contact with the heat-generating electronic components, and a number of receiving grooves are arranged on it, and a number of perforations are correspondingly arranged on the cooling fins. There are two linear heat releasing sections, the heat absorbing section ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/427
Inventor 郭青磊朱寿礼杨明
Owner FU ZHUN PRECISION IND SHENZHEN