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Method for solid support of modified nano titanium dioxide by chemically plating nickel-copper-phosphor alloy

A nano-titanium dioxide, electroless nickel-copper plating technology, applied in liquid chemical plating, electrophoretic plating, superimposed layer plating, etc. Good degradation effect, wide application range, easy to control effect

Inactive Publication Date: 2010-10-20
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, there are various adsorbents such as silica gel, activated carbon, etc., which are directly used in the solution and carried out in a suspension system, and there is still the inconvenience of filtering out the photocatalyst after the reaction; the polymer carrier itself can be used Nano Titanium Dioxide TiO 2 Photodegradation can only be used for a short period of time; although various glass carriers have good light transmission performance, they have the problem of poor adhesion; ceramic carriers have poor light transmission performance, and the pore size is not easy to match with the catalyst particle size; 3+ 、Cr 3+ Ions easily enter nanoscale titanium dioxide TiO 2 layer, destroying its crystal lattice, reducing catalytic activity, and nano-titanium dioxide TiO 2 Poor bonding performance between layer and metal carrier
Adding Nano Titanium Dioxide TiO to Electroless Nickel Plating Copper Phosphorus Alloy Bath 2 particles that make nickel-copper-phosphorus alloy with nano-titanium dioxide TiO 2 Co-deposition of particles onto metal or non-metal substrates is the solution to the problem of nano-titanium dioxide TiO 2 An important way to immobilize, but the co-deposited layer obtained by this method is nano-titanium dioxide TiO 2 The content is low, which affects the use effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The method for electroless nickel-plating copper-phosphorus alloy immobilized modified nano-titanium dioxide comprises the following steps:

[0022] After polishing the red copper sheet with a size of 20×30×1.5 mm with silicon carbide sandpaper, it was ultrasonically cleaned in acetone for 5 minutes, taken out and dried in air at room temperature. Put the copper sheet into 1% stannous chloride solution and soak for 1 minute, rinse with water, then immerse in 0.1% palladium chloride solution for 30 seconds, wash with water and dry in the air for later use.

[0023] Weigh 3 grams of zinc-doped nano-titanium dioxide with an average particle size of 20 nm, add it into 500 ml of acetone, and stir it ultrasonically for 30 minutes to prepare solution A.

[0024] Submerge the graphite electrode and copper sheet in a glass vessel containing solution A, use graphite as the anode, and make the copper sheet parallel to the graphite, electrophoresis for 1 minute under the condition ...

Embodiment 2

[0028] The method for electroless nickel-plating copper-phosphorus alloy immobilized modified nano-titanium dioxide comprises the following steps:

[0029] After polishing the nickel sheet with a size of 20×30×2 mm with silicon carbide sandpaper, it was ultrasonically cleaned in acetone for 5 minutes, and then taken out and dried in air at room temperature.

[0030] Weighed 8 grams of cobalt-doped nano-titanium dioxide with an average particle size of 25 nm, added it to 500 ml of acetone, and stirred it ultrasonically for 30 minutes to prepare solution B.

[0031] Submerge the graphite electrode and copper sheet in a glass vessel with solution B, use graphite as the anode, and make the nickel sheet parallel to the graphite, electrophoresis for 1 minute under the condition of the voltage between the electrodes is 50V / cm, and the current is 0.5mA to obtain cobalt Doped nano titanium dioxide deposition layer.

[0032] Preparation of electroless nickel-plating copper-phosphorus a...

Embodiment 3

[0035] The difference from Example 2 is that the average particle size is 15nm cerium-doped nano-titanium dioxide powder; the chemical nickel-plating copper-phosphorus alloy solution is prepared, nickel sulfate 15 grams per liter; copper sulfate 10 grams per liter; hypophosphorous acid Sodium 30 g / L; trisodium citrate 40 g / L; sodium acetate 10 g / L, adjust the pH value to 3.0. The solution was heated to 50 °C. The nickel sheet coated with the rare earth cerium-doped nano-titanium dioxide deposition layer is put into the electroless nickel-copper-phosphorus alloy plating solution for 3 hours to obtain the cerium-doped nano-titanium dioxide composite coating immobilized by the nickel-copper-phosphorus alloy.

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Abstract

The invention relates to a method for modifying nano titanium dioxide supported on chemical nickel plating copper phosphorus alloy which can make modifying nano TiO2 volume content in a compound plating layer reach to above 70%, the compound plating layer combines with metallic matrix well, and can be used for light-catalyzed reaction processed in solution. A special technique is that: firstly, confecting acet solution containing 6-12 g / L modifying TiO2, depositing a modifying nano TiO2 grain layer on the copper or nickel matrix by using electrophoresis technique, then placing the copper sheet or nickel sheet doping the nano TiO2 layer into the chemical plating nickel copper phosphorus alloy solution and leaving period of time, then preparing a nickel copper phosphorus alloy / modifying nano TiO2 compound plating layer and realizing supporting on modifying nano TiO2. The method can realize supporting on nano TiO2 granule, and increase nano TiO2 content in the depositing layer.

Description

technical field [0001] The invention relates to nanometer material preparation technology, specifically adopts electrophoresis and electroless nickel-plating copper-phosphorus alloy composite treatment method to solve the immobilization problem of modified nano-titanium dioxide in photocatalysis in solution. Background technique [0002] In semiconductor photocatalytic materials, titanium dioxide TiO 2 It has the characteristics of good biological and chemical inertness, strong oxidation performance and low cost. Titanium dioxide TiO 2 It is a wide-bandgap n-type semiconductor material. If it is irradiated by light with energy greater than its forbidden bandwidth, the electrons on the valence band (e - ) will be excited to the conduction band, generating corresponding holes in the valence band (h + ), the negatively charged electrons and positively charged holes and the water H adsorbed on the semiconductor surface 2 O and oxygen O 2 react to generate reactive groups su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C25D13/02C23C18/36C23C28/00
Inventor 吴玉程朱绍峰黄新民
Owner HEFEI UNIV OF TECH