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Devices and methods for measuring wafer characteristics during semiconductor wafer polishing

A wafer-specific technology used in semiconductor wafer processing to address fragility, unreliable adhesives, and expensive fiber optic bundles

Inactive Publication Date: 2009-07-29
STRASBAUGH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, subsequent testing showed that the use of adhesives may not be reliable in order to prevent the polishing slurry, which can contain reactive chemicals, from entering the light sensor and passing through the polishing pad to the support table
[0006] In summary, although several techniques are known in the art for monitoring polished surfaces during polishing, none of these techniques is entirely satisfactory
The fiber optic bundle described by Tang et al. is expensive and potentially fragile; while the application of an interferometer under the platen as used by Birang et al. requires the formation of a gap through the platen supporting the polishing pad

Method used

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  • Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
  • Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
  • Devices and methods for measuring wafer characteristics during semiconductor wafer polishing

Examples

Experimental program
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Embodiment Construction

[0031] figure 1 is a top view of the chemical mechanical planarization system 1 with the sensor port 2 cut into the polishing pad 3 . A wafer 4 (or other workpiece to be planarized or polished) is held by a polishing head 5 and suspended above a polishing pad 3 from a translation arm 6 . Other systems may use several polishing heads holding several wafers, and separate translation arms on opposite sides (left and right) of the polishing pad.

[0032] The mortar used in the polishing process is injected onto the surface of the polishing pad through the mortar injection pipe 7 . Suspended above the pad 3 is a cantilever 8 having a wireless transceiver 9 in electrical communication with a CMP data collection and control system 10 for the CMP system 1 .

[0033] The sensor port rotates with the polishing pad which itself rotates on the process drive table or platen 18 in the direction of arrow 12 . The polishing heads rotate about their respective axes 13 in the direction of ar...

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Abstract

A system and method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an indwelling optical sensor, disposed within a polishing pad and data signals are wireless transmitted to a control system.

Description

technical field [0001] The present invention relates to the field of semiconductor wafer processing, and more particularly to sensor assemblies disposed within disposable polishing pads used in chemical mechanical polishing. The polishing pad contains sensor assemblies to monitor wafer characteristics during polishing operations, allowing process adjustments. Background technique [0002] Several designs for windows installed in polishing pads are disclosed in US Patent No. 5,893,796, issued April 13, 1999, to Birang et al., and its successor, 6,045,439, issued April 4, 2000. The wafer to be polished is placed on top of a polishing pad which rests on a rigid platen so that polishing occurs on the lower surface of the wafer. The interferometer directs the laser beam upwards and causes it to reach the lower surface of the wafer where it must pass through a gap in the platen and then continue upwards through the polishing pad. To prevent the accumulation of grout above the cr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B44C1/22
CPCB24B49/12B24B49/14B24B37/0056B24B37/205B24B37/013H01L21/302H01L21/304H01L22/00
Inventor R·D·贝纳西
Owner STRASBAUGH