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A technology of fixtures and pressurized parts, applied in the fields of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of the electrical signal of the package body 71 being unable to be transmitted, damaged, etc., to improve product yield and maintain reliability Effect

Inactive Publication Date: 2011-04-06
BOARDTEK COMP SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, part of the solder joints 73 on the circuit board 72, especially the solder joints 73 away from the locked place (as shown by the circular dotted line in FIG. 1B ) will be damaged due to the influence of uneven stress, and then the package body The electrical signal of 71 cannot be transmitted to the circuit board 72 and becomes a defective product
The above-mentioned problems become more serious after the surface mount technology (SurfaceMount Technology, SMT) largely adopts lead-free process.

Method used

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Embodiment Construction

[0020] A jig and an assembly method using the jig according to preferred embodiments of the present invention will be described below with reference to related drawings, wherein the same components will be described with the same reference symbols.

[0021] Please refer to FIG. 2 to FIG. 5 to illustrate the assembly method and the jig 1 using the jig 1 .

[0022] FIG. 2 is a top view showing a jig 1 according to the first embodiment of the present invention, which includes a body 11 , a pressing part 12 and an operating part 13 . Wherein, the pressurizing part 12 is disposed on one side of the main body 11 , and the operating part 13 is disposed on the other side of the main body 11 . It should be noted that the present invention does not limit the shapes of the main body 11, the pressurizing part 12 and the operating part 13. The main body 11 is preferably a regular polygon, and the pressing part 12 and the operating part 13 can be arranged symmetrically or diagonally. . In...

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Abstract

The invention relates to a tool used for assembling an electronic device provided with a packaging body and a circuit board. The packaging body is connected with the circuit board by at least one welding spot. The tool comprises a body, at least one pressurizing part and an operating part. The pressurizing part is arranged at one side of the body, and the operating part is arranged at the other side of the body, wherein the pressurizing part applies a first pressure on the electronic device, and the first pressure is greater than a second pressure applied by the operating part on the electronic device.

Description

technical field [0001] The invention relates to a jig, in particular to a jig for assembling an electronic device. Background technique [0002] Since the ball grid array package (BGA) can make the space at the bottom of the chip relatively large, more pins can be accommodated on the premise of ensuring a large pin pitch to meet the needs of denser signal I / O. In addition, the goal array package also has many advantages such as easy chip installation, better electrical performance, low signal transmission delay, allowing high-frequency operation, and excellent heat dissipation. Therefore, the goal array package has been widely used in the packaging of many electronic components. . Taking the mainboard of a notebook computer as an example, there are also electronic components on the mainboard that are packaged in a goal array. [0003] As shown in FIG. 1A and FIG. 1B , it is a schematic diagram of assembly of a known electronic device 7 with a goal array package. FIG. 1A is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/34
Inventor 张木财郑定群陈富明
Owner BOARDTEK COMP SUZHOU