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Preparation of chemical mechanical grinding fluid

A technology of chemical machinery and grinding fluid, which is applied in the field of grinding and polishing of soft and brittle functional crystals of II-VI compounds, can solve the problems of easy embedding of free abrasives, easy breakage of workpieces, high scrap rate, etc., and achieve high-efficiency stress-free ultra-precision Grinding and polishing effect, ultra-smooth and ultra-precision grinding and polishing effect, high material removal rate effect

Inactive Publication Date: 2011-10-19
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a kind of preparation method of chemical mechanical grinding fluid, adopt a kind of free abrasive, chelating agent, surface dispersant, oxidizing agent only contain organic acid, inorganic acid, organic alcohol, bromine, deionized water or distilled water Aqueous solution, which solves the defects that free abrasives are easy to embed when the soft and brittle crystals of II-VI compounds are processed by traditional processing methods, the processed surface is easy to scratch, micro-cracks, plastic deformation, workpieces are easy to break, and the reject rate is high.

Method used

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Embodiment Construction

[0006] The specific implementation manner of the present invention will be described in detail below in conjunction with the technical solutions.

[0007] Choose 10×10×2mm 3 The CdZnTe wafer was used to complete the chemical mechanical grinding test on a VG401 MKII 300mm precision Si wafer grinder. First, the CdZnTe wafer was installed on the workbench using a microporous ceramic vacuum chuck. The diameter of the small hole of the microporous ceramic chuck is 0.5 mm, and the diameter is 180 mm. Since the diameter of the vacuum ceramic chuck is larger than that of the CdZnTe wafer, a 0.5mm thick polyethylene sheet is used to dig out 8×8mm 2 The hole, put the CdZnTe wafer on it to complete the automatic loading and unloading of the workpiece, and can avoid defects such as scratches on the workpiece using mechanical fixtures. The micropowder diamond grinding wheel of #5000 grinding wheel was used for the preliminary precision grinding test. The grinding fluid was deionized wate...

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Abstract

The invention relates to a preparation method for a chemical machinery grinding fluid, which belongs to the technical field of soft and fragile functional crystal grinding and polishing processing. The invention particularly relates to an II-VI compound soft and fragile functional crystal grinding and polishing processing method. The chemical machinery grinding fluid is characterized in that the chemical machinery grinding fluid does not contain any free abrasive, surface dispersant, oxidant and activator, and only consists of one of bromine, deionized water or distilled water, nitric acid and organic acid, one of organic alcohols, and one of inorganic acid. The volume percent of the bromine to the organic alcohol is 1 to 5 percent; and the volume percent of the nitric acid to the inorganic acid to the organic acid is 0.5-1:3-5:10-20. The deionized water or distilled water is used to dilute the pH value to 2.0 to 3.2 so as to prepare the chemical machinery grinding fluid. The grindingfluid adopts two modes of chemical corrosion and chemical reaction to remove the material, has higher material removal rate, effectively avoids the defects of free abrasive embedment, scuffing, micro-crack, plastic deformation, and the like, and reaches high efficiency stress free ultraprecise grinding and polishing effects.

Description

technical field [0001] The invention belongs to the technical field of grinding and polishing of soft and brittle functional crystals, and in particular relates to a grinding and polishing method for soft and brittle functional crystals of II-VI compounds. Background technique [0002] II-VI compound soft and brittle crystals, as a new type of crystal with special photoelectric functions, play an extremely important role in the fields of military, national defense, aviation, aerospace, and national economy, and have been widely used. Typical representatives such as HgCdTe, CdZnTe, HgMnTe, CdMnTe, HgInTe, etc. However, this soft and brittle functional crystal is different from the widely used hard and brittle functional crystals, such as Si wafers, MgO wafers, diamond wafers, sapphire wafers, etc., and also different from traditional soft plastic materials, such as copper, iron, aluminum, etc. , is a typical difficult-to-machine material. The processing surface is required ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/18
Inventor 张振宇周红秀郭东明高航康仁科
Owner DALIAN UNIV OF TECH