Preparation of chemical mechanical grinding fluid
A technology of chemical machinery and grinding fluid, which is applied in the field of grinding and polishing of soft and brittle functional crystals of II-VI compounds, can solve the problems of easy embedding of free abrasives, easy breakage of workpieces, high scrap rate, etc., and achieve high-efficiency stress-free ultra-precision Grinding and polishing effect, ultra-smooth and ultra-precision grinding and polishing effect, high material removal rate effect
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[0006] The specific implementation manner of the present invention will be described in detail below in conjunction with the technical solutions.
[0007] Choose 10×10×2mm 3 The CdZnTe wafer was used to complete the chemical mechanical grinding test on a VG401 MKII 300mm precision Si wafer grinder. First, the CdZnTe wafer was installed on the workbench using a microporous ceramic vacuum chuck. The diameter of the small hole of the microporous ceramic chuck is 0.5 mm, and the diameter is 180 mm. Since the diameter of the vacuum ceramic chuck is larger than that of the CdZnTe wafer, a 0.5mm thick polyethylene sheet is used to dig out 8×8mm 2 The hole, put the CdZnTe wafer on it to complete the automatic loading and unloading of the workpiece, and can avoid defects such as scratches on the workpiece using mechanical fixtures. The micropowder diamond grinding wheel of #5000 grinding wheel was used for the preliminary precision grinding test. The grinding fluid was deionized wate...
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