Substrate module, method for manufacturing substrate module, and electronic device

Abstract

The present invention discloses a a substrate module, a method for manufacturing the substrate module and a electronic device. In a substrate module (1) of the present invention, a connection electrode (4) is provided on a first surface (2a) of a substrate (2), and a first penetrating hole portion (5) is running through the substrate (2) in a thickness direction thereof so as to reach a reverse surface of the connection electrode (4), with a penetrating electrode (6) being provided inside the first penetrating hole portion (5). The penetrating electrode (6) defines a depression (6a) in a position opposing the reverse surface of the connection electrode(4), and an upper portion of the penetrating electrode (6) is thicker than a side portion (6) of the penetrating electrode. The penetrating electrode is present also on a second surface (2b) of the substrate, and is connected to a wiring electrode (7) on the second surface.

Description

technical field [0001] The present invention relates to a substrate module, a manufacturing method of the substrate module, and an electronic machine including the substrate module. Background technique [0002] In recent years, in order to improve the productivity of electronic equipment or to reduce the size, thickness, and weight of electronic equipment, many substrate modules in which electronic components are integrated are used. A substrate module in which electronic components are integrated generally has the following structure. [0003] That is, the substrate module includes a substrate, electronic components, connection electrodes, first through hole portions, through electrodes, wiring electrodes, and mounting electrodes. Electronic components are mounted on the first surface of the substrate or inside the substrate. The connecting electrodes are electrically connected to the electronic components and are arranged on the first surface of the substrate. The firs...

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Problems solved by technology

[0005] In the conventional example described above, if the thickness of the through-hole in the through-hole is made uniform (if the through-electrode is formed so that the thickness on the back surface of the connection electrode is equal to the thickness on the side surface of the through-hole portion), when If the stress that causes the connection electrodes to peel off occurs on the first surface of the substrate, the connection electrodes will be damaged or peeled off together with the through electrodes.

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