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Problems solved by technology
Similarly, in the connection between circuit boards and circuit boards, narrow pitches, many pins, and high reliability are also required, and there are similar problems in these aspects
Method used
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no. 1 Embodiment approach
refer to image 3 (a)-(e) describe the manufacturing method of the electronic component package in 1st Embodiment of this invention. First, if image 3 As shown in (a), the 1st electronic component 1 which has several electrodes a (6) on the surface A, and the 2nd electronic component 2 which has some electrodes b (6) on the surface B are prepared. At least one concave portion 5 is provided on the surface A of the first electronic component 1 (except for the surface region where a plurality of electrodes a ( 6 ) are provided). Similarly, one concave portion 5 is provided at least on the surface B of the second electronic component 2 (except for the surface area where the plurality of electrodes b ( 6 ) are provided).
[0035]
Then, if image 3 As shown in (b), the resin composition 3 containing the resin 7 and the solder powder 4 is supplied (for example, coated) to the surface A of the first electronic component 1 on which a plurality of electrodes a ( 6 ) are formed.
...
no. 2 Embodiment approach
Next, refer to Figure 4 (a)-(f) describe the manufacturing method of the electronic component with a solder bump in 2nd Embodiment of this invention. First, if Figure 4 As shown in (a), the electronic component 1 which has several electrodes 6 on the surface is prepared. At least one recess 5 is provided on the surface of the first electronic component 1 (except for the surface area where the plurality of electrodes 6 are provided).
[0039]
Then, if Figure 4 As shown in (b), the resin composition 3 containing the resin 7 and the solder powder 4 is supplied (for example, coated) to the surface of the first electronic component 1 on which the plurality of electrodes 6 are formed.
[0040]
Next, if Figure 4 As shown in (c), the flat plate 12 is brought into contact with the surface of the resin composition 3 supplied to the first electronic component 1 to roughly form a closed space (from this aspect, the “flat plate” can be referred to as “flat plate” in the present ...
no. 3 Embodiment approach
Next, as a third embodiment, a method of manufacturing an electronic component with solder bumps using a flat plate on which recesses are formed will be described. Figure 5 (a)-(f) show the form of this 3rd embodiment. Unless otherwise stated, it is the same as the above-mentioned second embodiment, and repeated descriptions are omitted.
[0042]
In the third embodiment, although the concave portion is not provided on the surface of the electronic component 1 , the concave portion 5 is provided on the surface of the flat plate 12 . In this way, after heating, bubbles 10 will be generated using the concave portion 5 of the flat plate 12 as a starting point (refer to Figure 5 (d)). Then, the air bubbles generated by using the concave portion 5 as a starting point promote the movement of the resin 7 and the solder powder 4 contained therein. Here, preferably as Figure 5 As shown in (c) to (e), the flat plate 12 is brought into contact with the surface of the resin so that...
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PUM
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Abstract
A method for manufacturing an electronic component mounting body comprising (1). a step for preparing a first electronic component and a second electronic component having at least one recess formed in the surface A of the first electronic component (excepting the surface region provided with a plurality of electrodes (a)) and / or the surface B of the second electronic component (excepting the surface region provided with a plurality of electrodes (b)), (2). a step for supplying resin containing solder powder to the surface A of the first electronic component, (3). a step for abutting the second electronic component against the resin surface such that the electrode (a) of the first electronic component opposes the electrode (b) of the second electronic component, and (4). a step for heating the first electronic component and / or the second electronic component to form a solder joint for electrically interconnecting the electrodes ((a) and (b)) from solder powder. At the step (4), bubbles are generated in the resin starting from the recess when the electronic component is heated and the solder powder is moved by the bubbles thus generated and collected on the electrodes (a and b).
Description
technical field [0001] The present invention relates to an electronic component package, an electronic component with a solder bump (solder bump), and their manufacturing methods. More specifically, the present invention relates to an electronic component package and an electronic component with solder bumps characterized by providing recesses on the surface of the electronic component, and to manufacturing electronic component packages and solder bumps using the electronic component provided with recesses on the surface. method of electronic components of the station. Background technique [0002] In recent years, along with the high density and high integration of semiconductor integrated circuits (LSI) used in electronic equipment, the number of pins and the narrowing of the pitch of the electrodes of the LSI chip are rapidly developing. When mounting these LSI chips on circuit boards, flip-chip mounting is widely used in order to reduce wiring delays. In this flip-...
Claims
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Application Information
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