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White light LED light source module adopting COB technology and array interconnecting

An LED light source and LED chip technology, which is applied to optical elements, light sources, electric light sources and other directions for changing the spectral characteristics of emitted light, can solve problems such as improvement, poor consistency of white light brightness, and insufficient consideration of excitation light uniformity. To achieve the effect of simple production process, uniform brightness and compact structure

Active Publication Date: 2012-05-30
深圳成光兴光电技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the disadvantages of the white LED lamps disclosed in CN101017814A and CN101294662A are: firstly, insufficient consideration is given to the uniformity of excitation light, which brings inconvenience to the smearing process of phosphor powder, that is, it is difficult to achieve uniform smearing of phosphor powder, so the prepared The luminance consistency of white light is poor; the second is that the packaging density of LED chips is difficult to increase, which limits the brightness per unit area of ​​the light source module and the increase in output luminous flux; the third is that the circuit connection method adopts the traditional series-parallel form. , the reliability and life of the light source are affected; Fourth, there is still room for improvement in the structure and process, and insufficient consideration is given to the subsequent use of the product

Method used

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  • White light LED light source module adopting COB technology and array interconnecting
  • White light LED light source module adopting COB technology and array interconnecting
  • White light LED light source module adopting COB technology and array interconnecting

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Embodiment Construction

[0015] The invention will now be described with reference to the accompanying drawings.

[0016] Such as Figure 1-3 As shown, the white light LED light source module provided by the present invention includes a module housing 1 with an opening, a circuit board 2 disposed inside the module housing 1, an LED chip array 3 disposed on the circuit board 2, and packaging the LED chip array 3 The encapsulation glue 4 on the circuit board 2, the high-transmittance light-emitting plate 5 covering the opening of the module housing 1, and the high-transmittance light-emitting plate 5 are coated closer to the LED chip 3 Phosphor layer 6 on the surface.

[0017] Specifically as figure 1 As shown, the arrayed interconnected LED chips 3 are packaged on the circuit board 2 using COB packaging technology, and a layer of chip array packaging glue 4 is covered on the surface of all the LED chips 3, and then the circuit board 2 is placed in the module housing 1 interior. The use of COB techn...

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Abstract

The invention relates to a white light LED light source module adopting the COB technology and array interconnecting, which comprises a module shell (1) with an opening, a circuit board (2) arranged in the module shell (1), an LED chip array (3) arranged on the circuit board (2), encapsulating adhesive (4) which encapsulates the LED chip array (3) on the circuit board (2), a high light-transmission light-emitting board (5) which covers the opening of the module shell (1) and a fluorescent substance layer (6) which is coated on the high light-transmission light-emitting board (5) and is more close to the surface of the LED chip array (3). The white light LED light source module has uniform light brightness, high brightness, good reliability, compact structure, simple manufacture and convenient use for follow-up design.

Description

technical field [0001] The invention relates to a light source module, in particular to a white LED light source module adopting COB technology and arrayed interconnection. Background technique [0002] The white light LED lamps in the prior art generally have blue light-generating LED chips closely attached to fluorescent material layers and packaged in a closed space to form white light LEDs. [0003] The disadvantage of this structure is that the blue LED chip and the fluorescent material layer form an integral body, so the two cannot be separated from each other, which leads to some problems, such as because the phosphor is directly coated on the blue LED chip, so the uniformity of the phosphor is difficult. control, which in turn leads to poor brightness consistency of the final white LED finished product, and it is difficult to adjust the color temperature of the finished white LED lamp after the finished product is manufactured; The heat promotes the high working tem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S2/00F21V15/02F21V19/00F21V5/00F21V9/10F21V23/06H01L33/00F21Y101/02F21V9/40F21Y115/10
Inventor 李炳乾郑同场
Owner 深圳成光兴光电技术股份有限公司