Temperature control method for projection objective of photoetching machine
A temperature control method and technology of projection objective lens, which are applied in optics, photography, photoengraving process of pattern surface, etc., can solve the problems of long search process and increase of system stabilization time, etc.
Active Publication Date: 2010-12-29
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD +1
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[0042] Such as figure 1 In the objective lens temperature control system shown, the TCU receives the set value sent by the controller module, and controls the internal heater and cooler according to a certain algorithm, thereby controlling the temperature of the circulating fluid to near the set value. The circulating fluid provided by the TCU is divided into multiple tributaries by the splitter, which flows through the projection objective lens and other object elements, and is finally combined by the current collector to flow back to the TCU.
[0043] The present invention provides a temperature control device, which mainly includes a measurement module M0 and a controller module M1.
[0044] Such as figure 2 As shown, the present invention provides a temperature control device for sending commands to the TCU, which includes a temperature measurement module M0 and a controller module M1. The temperature measurement module M0 includes an excitation source C01, a sensor C02, an A / D...
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The invention provides a temperature control method for a projection objective of a photoetching machine, where the objective temperature is regulated to a set value of the objective temperature by use of a temperature control unit (TCU), comprising the following control steps: initializing system parameters, deciding to enter which control step: pre-regulating the TCU inner water temperature to aset value; using switch control, with the objective temperature as a master control variant, controlling the objective temperature in a target accuracy of step P2; using a cascade control arithmeticwith a Smith predictor, with the objective temperature as the master control variant, using an increment PID arithmetic, and a water temperature at a flow plate as a secondary control variant, using an increment PI arithmetic for the secondary control loop; using a cascade control arithmetic without a Smith predictor, with the objective temperature as a master control variant, using an increment PI arithmetic for the master control loop, and the water temperature at the flow plate as a secondary control variant, using the increment PI arithmetic for the secondary control loop; using the increment PI arithmetic, where the control variant is the water temperature at the flow plate.
Description
Technical field [0001] The invention belongs to the field of component temperature control, and relates to a temperature control method of a projection objective lens of a photoetching machine. Background technique [0002] In the semiconductor industry, constant temperature control of certain key components is required, such as the projection objective in the lithography machine. Due to the small working space of these key parts, strict requirements on the working environment, and high temperature control accuracy requirements, they cannot be directly controlled by ordinary temperature control equipment such as fans, electric heaters, and air conditioners. [0003] At present, the industry generally adopts special equipment to control the temperature. These special temperature control equipment control the temperature of the key parts by providing a temperature-controlled circulating fluid to exchange heat with the key parts. [0004] In the projection objective temperature control...
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IPC IPC(8): G03F9/00
Inventor 金敏李小平聂宏飞汤勇余小虎黄友任于文忠罗晋
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD