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Heat exchanger for use in cooling of semiconductor element and method for manufacturing the same

一种热交换器、半导体的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决损害微通道性能等问题，达到提高热传递性能、高稳定性和可靠性、防止气泡存留的效果

Inactive Publication Date: 2011-10-05
NEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these are precisely the negative approaches that result in compromising the performance of microchannels

Method used

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  • Heat exchanger for use in cooling of semiconductor element and method for manufacturing the same
  • Heat exchanger for use in cooling of semiconductor element and method for manufacturing the same
  • Heat exchanger for use in cooling of semiconductor element and method for manufacturing the same

Examples

Experimental program
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Effect test

no. 1 example

[0045] Refer to the following figure 1 and figure 2 A first embodiment of the present invention is described. figure 1 A double layer heat exchanger is shown comprising a partition which is elastically deformable according to the pressure of the two layers. The heat exchanger comprises a coolant holding layer 7 in the upper part and a heat receiving layer 16 comprising microchannels 1 in the lower part.

[0046] The partition wall 17 is provided at the connection interface between the coolant holding layer 7 and the heat receiving layer 16 to serve as a stopper that blocks the flow of the coolant supplied to the coolant holding layer 7 through the fluid inlet 4 to prevent The coolant flows into the heat receiving layer 16 . Therefore, the flow velocity in the coolant holding layer 7 is slower than that in the heat receiving layer 16 , and the pressure in the coolant holding layer 7 is higher than that in the heat receiving layer 16 . In addition, the fluid inlet 4 can be ...

no. 2 example

[0050] Refer to the following image 3 A second embodiment of the present invention is described. image 3 A double-layer heat exchanger according to a second embodiment of the present invention is shown, which leaks the coolant from the coolant holding layer 7 to the heat receiving layer 16 , thereby causing a secondary flow in the heat receiving layer 16 . In this embodiment, the inelastic partition 12 is used as the partition. The nozzles 13 constituting the novel feature of this embodiment and inducing the secondary flow are oriented at a predetermined angle in the forward direction with respect to the flow of the coolant through the microchannel 1 to effectively induce the secondary flow.

[0051] Under this structure, the leakage flow flowing from the coolant holding layer 7 into the heat receiving layer 16 through the nozzle 13 causes a secondary flow in the heat receiving layer 16, thereby dispelling the bubbles by the accelerated flow generated in the heat receiving ...

no. 3 example

[0053] Refer to the following Figure 4 A third embodiment of the present invention is described. Figure 4 A double layer heat exchanger according to a third embodiment of the invention is shown, said heat exchanger comprising a mechanism in which the saturated fluid outlet 15 and the steam outlet 8 are located away from each other. In this embodiment, although the advantage of reducing the size of the inlet manifold 5 cannot be obtained compared with the conventional mode because the fluid inlet 4 is located on the intake manifold 5, the heat exchanger group 2 can also be used as an air- Liquid separation mechanism, said gas-liquid separation mechanism helps to reduce the footprint of the heat exchanger compared to conventional models.

[0054] The coolant supplied through the fluid inlet 4 is directly supplied to the heat receiving layer 16 . The liquid-phase coolant flows from the heat receiving layer 16 into the coolant holding layer 7 through the micropores 14 . The i...

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PUM

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Abstract

Stable operation and improved reliability of a phase-change heat exchanger provided with microflow passages are realized by controlling the behavior of steam bubbles being produced. In the heat exchanger, the microflow passages are manufactured in two layers and are formed of a material which causes elastic deformation depending upon the difference in pressure between the layers. The layers are connected to each other, and resistance means having a given level of resistance to the flow of a coolant which flows from the coolant supply-side layer into the microflow passage-side layer is providedin the connection part. Under normal conditions, the internal pressure of the coolant supply-side layer is kept at a higher value than the internal pressure of the microflow passages. When steam bubbles are produced, the internal pressure of the microflow passages is rendered higher than the internal pressure of the coolant supply-side layer, whereby the elastic body is lifted and the steam bubbles are dispersed in the plurality of microflow passages. Alternatively, a construction may be adopted in which the internal pressure of the coolant supply-side layer is kept at a lower pressure than the internal pressure of microflow passages and, upon the occurrence of steam bubbles, the steam bubbles are sucked toward a lower pressure side.

Description

technical field [0001] The present invention relates to a heat exchanger for cooling semiconductors utilizing microchannels and boiling phenomena and a method of manufacturing such a heat exchanger. Background technique [0002] A technique has been developed for transferring the large amounts of heat generated by semiconductors, which involves adhering a material with high thermal conductivity to the outer part of the semiconductor and forming microchannels with a diameter of hundreds of microns or less , thereby performing liquid cooling. [0003] Recently, a technique of using a coolant flowing in a channel at a temperature close to the boiling point to utilize the heat of evaporation of the coolant and thus obtain a higher heat transfer effect is being studied. [0004] Although a detailed mechanism for improving heat transfer performance by boiling has not been explained, it is common knowledge that, for example, in a steam generator, the heat transfer coefficient beco...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427
CPCH01L23/427H01L2924/0002Y10T29/4935H01L2924/00
Inventor 坂本仁三洼和幸北城荣
Owner NEC CORP