Laser cutting forming machine and method for uncapping soft and rigid combination board

A laser cutting and forming machine technology, used in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of low efficiency, difficult to control precision, and high cost, and achieve the goal of reducing costs, saving processing time, and improving cutting accuracy. Effect

Inactive Publication Date: 2009-11-04
HANS LASER TECH IND GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the embodiment of the present invention is to provide a laser cutting forming machine, aiming to solve the problems of high cost, long cyc

Method used

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  • Laser cutting forming machine and method for uncapping soft and rigid combination board
  • Laser cutting forming machine and method for uncapping soft and rigid combination board
  • Laser cutting forming machine and method for uncapping soft and rigid combination board

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] The laser cutting forming machine provided by the embodiment of the present invention controls the galvanometer scanning system through the control system and uses the light spot formed by the laser focusing system to cut the workpiece to be processed according to the cutting pattern; the processing time is saved, the cost is reduced and the cutting accuracy is improved.

[0027] The module structure of the laser cutting forming machine provided by the embodiment of the present invention is as follows: figure 1 As shown, for ease of description, only the parts related to the embodiment of th...

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Abstract

The invention is applicable to the technical field of laser processing, and provides a laser cutting forming machine and a method for uncapping a soft and rigid combination board; the laser cutting forming machine comprises a laser, a light path conducting system, an oscillating mirror scanning system, a laser focusing system, a CCD positioning system and a control system; wherein the control system controls the energy of laser beams transmitted by the laser and controls the CCD positioning system to position the oscillating mirror scanning system according to cutting patterns and controls the oscillating mirror scanning system to carry out cutting processing on pieces to be processed by facula formed by focusing of the laser focusing system according to the cutting patterns. In the invention, the control system controls the oscillating mirror scanning system to carry out cutting processing on pieces to be processed by facula formed by focusing of the laser focusing system according to the cutting patterns, as a result, the laser cutting and forming machine of the invention saves process time, lowers cost and improves cutting precision.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser cutting forming machine and a method for opening the cover of a rigid-flex board. Background technique [0002] With the development of miniaturization of machines and instruments, circuit boards are more and more widely used in electronics, automobiles, aerospace, measurement and experimental equipment and other industries, and the corresponding output value is also increasing. The number of -Flex PCB (R&F board for short) is also increasing year by year. In the process of making the R&F board, it is necessary to open the cover of the hard material (prepreg) pressed on the soft board, so that the soft board is exposed so that the entire R&F board can be bent arbitrarily at the soft board. [0003] The traditional method is to use a mold punch to uncap the R&F board, but the cost of making the mold is expensive and the cycle is long, which leads to a...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/06B23K26/04B23K26/42B23K26/14B23K26/046B23K26/064B23K26/16B23K26/70
Inventor 高云峰吕洪杰翟学涛雷群
Owner HANS LASER TECH IND GRP CO LTD
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