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Evaporator and loop heat pipe using same

An evaporator and heat pipe technology, applied in the field of evaporators, can solve the problems of unsustainable backflow, poor sealing, easy leakage of gaseous working fluid, etc.

Inactive Publication Date: 2012-03-28
ADVANCED THERMAL DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] It should be noted that when the inner tube 114 is manufactured in the above-mentioned manner, the size of the inner tube 114 is not easy to be accurately controlled, so these steam passages 118 are prone to the problem of poor airtightness.
At this time, the gaseous working fluid flowing in these vapor passages 118 will easily leak into the liquid passage 116, thereby reducing the pressure difference between the opposite ends of the connecting pipe 120.
Therefore, the working fluid in the connecting pipe 120 may not be able to continuously flow back into the liquid channel 116, and the liquid working fluid in the liquid channel 116 may not be able to continuously penetrate into the vapor channels 118 through the capillary structures.
In this way, the cooling efficiency of the loop heat pipe 100 will be affected

Method used

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  • Evaporator and loop heat pipe using same
  • Evaporator and loop heat pipe using same
  • Evaporator and loop heat pipe using same

Examples

Experimental program
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Embodiment Construction

[0059] figure 2 It is a structural schematic diagram of a loop heat pipe according to an embodiment of the present invention, and Figure 3A for figure 2Schematic diagram of the structure of the sealing cover and the liquid storage tank in , and Figure 3B It is a structural schematic diagram of a sealing cover and a liquid storage tank according to another embodiment of the present invention.

[0060] Please refer to figure 2 and Figure 3A The loop heat pipe 200 includes at least one connecting pipe 210 (one is schematically shown in the drawings of this embodiment), an evaporator 300, and a working fluid (not shown) that is suitable for flowing in the connecting pipe 210 and the evaporator 300 drawn). Wherein, the evaporator 300 includes an outer tube 310 , a core material 320 disposed in the outer tube 310 , and a sealing cover 330 covering the core material 320 . Moreover, a first end 210a and a second end 210b of the connection tube 210 are respectively connecte...

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PUM

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Abstract

The invention discloses an evaporator applied to a loop heat pipe. The evaporator comprises an outer pipe, a core material and a sealing cover, wherein the outer pipe is provided with an opening end and a closed end; the core material arranged in the outer pipe is provided with a plurality of capillary structures, wherein a liquid passage is formed at the end of the core material, which is next to the opening end, while a steam passage is formed between the outer pipe and the core material; and the sealing cover is arranged at the opening end to cover the core material and expose the liquid passage. The sealing cover is provided with a first table flap and a second table flap, wherein the first table flap is butted to the outer surface of the outer pipe, while the second table flap is butted to the inner surface of the liquid passage to keep the core material between the outer pipe and the sealing cover.

Description

technical field [0001] The present invention relates to an evaporator, and more particularly to an evaporator used in a loop heat pipe. Background technique [0002] In order to keep the electronic product within its normal operating temperature range, the existing technology usually arranges heat dissipation fins (fin) on the heating element of the electronic product, and at the same time cooperates with the cooling airflow provided by the fan to quickly remove the Heat energy generated by a heating element during operation. However, in recent years, a loop-type heat pipe that conducts the heat energy generated by the heating element during operation through the conversion of liquid state and gaseous state has high heat transfer (30-6000W) and can The advantages of long-distance heat transfer (0.3m ~ 10m) have gradually attracted attention. [0003] figure 1 It is a schematic diagram of an existing loop heat pipe. Please refer to figure 1 The loop heat pipe 100 is usua...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/02H05K7/20
Inventor 许哲睿孙辅笙黄秉钧
Owner ADVANCED THERMAL DEVICES