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Method and equipment for manufacturing circuit board stepped groove

A manufacturing method and a stepped groove technology, which are applied in the fields of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of high cost, long time consumption, complicated processing process, etc., and achieve the effect of reducing production cost and shortening the processing cycle

Inactive Publication Date: 2009-12-02
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The existing step groove processing method has a complicated process, which needs to be realized by 2 times of lamination + 2 times of gong groove. In the production process, due to the high cost and long time of lamination, it directly leads to the printed circuit board with stepped groove. The processing cycle is longer and the cost is higher

Method used

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  • Method and equipment for manufacturing circuit board stepped groove
  • Method and equipment for manufacturing circuit board stepped groove
  • Method and equipment for manufacturing circuit board stepped groove

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Experimental program
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Embodiment Construction

[0030] The embodiment of the present invention provides a method for manufacturing the stepped groove of the circuit board and equipment for manufacturing the stepped groove of the circuit board, which can reduce the manufacturing cost of the stepped groove and shorten the processing cycle of the stepped groove.

[0031] The method for manufacturing the stepped groove of the circuit board and the equipment for manufacturing the stepped groove of the circuit board provided by the present invention are described in detail below.

[0032] circuit board image 3 Shown is the manufacturing method of the circuit board stepped groove in the first embodiment of the present invention, which includes the following steps:

[0033] B1, groove the prepreg at the bottom of the stepped groove according to the size of the stepped groove; the groove method here can be: use a Routing Cutter or a Milling Cutter to groove.

[0034] B2, stacking the copper clad laminate and the slotted prepreg to...

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Abstract

The invention discloses a method and equipment for manufacturing a circuit board stepped groove. The method of manufacturing the circuit board stepped groove comprises the following steps: grooving a prepreg; superposing a copper-clad plate with the grooved prepreg by a routing cutter and laminating to form a printed circuit board; grooving at the position of the printed circuit board corresponding to the position to be grooved for stepped groove to form the stepped groove by using a digging device. Compared with the existing scheme for manufacturing the circuit board stepped groove, due to reduced one-time lamination process which consumes longer time, the invention can reduce manufacturing cost of the stepped groove and shorten the process cycle of the stepped groove.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing stepped grooves on a circuit board and equipment for producing stepped grooves on a circuit board. Background technique [0002] Printed Circuit Board (PCB) stepped grooves are mainly used on power amplifier boards, and are an important part of heat dissipation solutions for high-power devices. They are widely used in the industry, but the processing process of the stepped grooves is complicated and the cost is high. [0003] At present, in the PCB industry, the process of PCB step groove processing is completed by "2 times of lamination + 2 times of gong groove". The processing flow diagram is as follows: figure 1 shown, including: [0004] A1. The first pressing: press together multiple copper-clad laminate layers (layers ≥ 2) that need to open stepped grooves; [0005] A2. Gong groove: at the position corresponding to the step groove, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K2203/1476H05K2203/0207H05K3/0044H05K2201/09845H05K2203/0228H05K2201/09036H05K3/4611
Inventor 李继厚黄明利
Owner HUAWEI TECH CO LTD