Method for processing stamped rigid-flexible board and rigid-flexible board

Abstract

The invention discloses a method for processing a stamped rigid-flexible board and the stamped rigid-flexible board. The shape (10) of a stamped product is required to have a chamfer angle (11) which is positioned at the junction of a rigid-flexible part (20) and a flexible part (30) that have a height difference, wherein if the height difference is less than 0.2 millimeter, the size of a rigid board (21) is increased to allow the rigid-flexible part (20) to cover the chamfer angle (11) when the rigid board (21) and a flexible board (22) are combined before stamping. Thus, the method avoids through stamping and cracking of the flexible part and improves yield during stamping.

Description

technical field [0001] The invention relates to a forming process of a rigid-flex circuit board, in particular to a processing method of a rigid-flex circuit board with a height difference that needs punching and the rigid-flex board. Background technique [0002] As a special electronic interconnection technology, the rigid-flex board can reduce the assembly size and weight of electronic products, avoid wiring errors, realize three-dimensional assembly under different assembly conditions, and have light, thin, short, small, and flexible structures. It has been widely used in computers, avionics, military electronic equipment, mobile phones, digital cameras, communication equipment, and analytical instruments. The United States is very mature in the use of rigid-flex boards in military and space science, and the number of layers is mostly 6, 8, and 10 layers. At present, Korean PCB manufacturers are the most mature in the technology of rigid-flex boards, and manufacturers ...

AI Technical Summary

Problems solved by technology

[0003] When punching the bonded rigid-flex board into the required circuit board shape with a mold, please refer to Figure 1 and Figure 2, Figure 1 shows the product shape 10 that needs to be punched out by the dotted line, there is a height difference at the junction of the rigid-flexible part 20 and the flexible part 30, if according to the conventional In the design of circuit boards, the junction with height difference is in the chamfering area of ​​the mold when punching; in practice, it is found that there is often a flexible layer that cannot be punched through at the chamfer when punching, and external force ( For example, when the product is separated from the waste by hand, it is easy to tear the flexible part of the product at the punching place, resulting in the scrapping of the product

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