Monitor burn-in test device and monitor burn-in test method

Abstract

The invention provides a monitor burn-in test device and a monitor burn-in test method. In a monitor burn-in test device (11), data is written all at once into a plurality of elements (16) requiring a refresh process. The refresh process is performed in the elements (16) after the write process. The data is held. When performing a read-out process, the refresh process is interrupted in the element (16) from which read-out is to be performed. Data is read out from the interrupted element (16). Thus, the refresh process is interrupted only in the element (16) from which read-out is to be performed. Accordingly, the refresh process can be continued in the element (16) other than the element from which read-out is to be performed. Thus, the data is surely held. The data write-in process may be completed at once. Thus, the monitor burn-in test can be effectively performed.

Description

technical field [0001] The present invention relates to a monitoring aging test device used, for example, in a monitoring aging test. Background technique [0002] For example, a so-called monitor burn-in test is performed before product shipment of semiconductor devices such as SRAMs. In practice, a plurality of semiconductor devices of the test object are mounted on a burn-in board. The semiconductor device is heated by, for example, a heater. Semiconductor devices are maintained at a high temperature of, for example, 100 degrees Celsius. At this time, the semiconductor device is driven. A voltage of a higher value than usual is applied to the semiconductor device. The operation of the semiconductor device is checked in this way. [0003] When carrying out the operation check in the monitor burn-in test, first, (1) carry out the writing and reading process. In this step, data write processing and read processing are performed. At this time, the written data is compa...

AI Technical Summary

Problems solved by technology

Therefore, for example, when the size of the test object blocking the bottom surface of the metal pipe increases, the bottom surface of the heater cannot contact the test object with a sufficient area.

Such heaters lack versatility

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