Welding method and welding structure of conductive terminals
A technology of conductive terminals and welding methods, applied in welding equipment, resistance welding equipment, conductors, etc., can solve the problems of low welding strength, spread, explosion, etc., and achieve good welding results
Inactive Publication Date: 2010-01-20
OMRON AUTOMOTIVE ELECTRONICS CO LTD
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Problems solved by technology
[0037] Thus, at the respective soldering locations of the leads 11p, 11q, as Figure 8 The shown flat portions 12p, 12q crushed in the direction perpendicular to the paper surface are produced on the leads 11p, 11q facing the electrodes 31p, 31q, respectively, and therefore, there is a problem that the welding strength is lowered.
[0038] In addition, in addition to the above-mentioned problems, since the Joule heat diffuses to the entire metal plates 21p and 21q, welding spreads to parts that do not need to be welded. In addition, overheating of the lead wires 11p and 11q may also cause damage to the welded parts. explode
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[0069] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0070] In addition, the later Figure 1 ~ Figure 4 , mark the same part or the corresponding part with the same symbol.
[0071] figure 1 It is a figure which shows one embodiment of the welding method and welding structure of this invention.
[0072] In the figure, 100 is a ceramic capacitor, and 21a and 21b are metal plates (lead frames) on which the ceramic capacitor 100 is mounted.
[0073] In this embodiment, the diameter of the lead wires 11a, 11b is about 0.5 [mm] to 0.75 [mm], and the ceramic capacitor 100 having the lead wires 11a, 11b made of steel wire is used, and a thickness of 1.0 [mm] is used. A steel plate of ~1.8 [mm] is molded into metal plates 21a, 21b having shapes described later.
[0074] E.g figure 1 Among them, the diameter d of the lead wires 11a, 11b of the ceramic capacitor 100 is 0.5 [mm], and the thickness of the metal plates 21a, 21b...
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Abstract
This invention provides a welding method and a welding structure capable of carrying out satisfactory weeding without forming a projection when joining the conductive terminals by resistance welding. A projection (22a, 22b) projecting in a direction orthogonal to a longitudinal direction of a metal plate (21a, 21b) is formed on one part of the metal plate (21a, 21b) as a welding place of when carrying out welding on a lead wire (11a, 11b), and the lead wire (11a) and the projection (22a) and the lead wire (11b) and the projection (22b) are resistance-welded with the longitudinal direction of the metal plates (21a, 21b) and the projecting direction of the projections (22a, 22b) orthogonal to each other.
Description
technical field [0001] The present invention relates to a welding method and a welding structure for welding conductive terminals to each other by resistance welding. Background technique [0002] Figure 5 It is a figure which shows an example of the electronic component normally equipped inside electronic equipment (illustration omitted). [0003] In the figure, 200 is a ceramic capacitor which is one of the above-mentioned electronic components, and 11p and 11q are lead wires of the ceramic capacitor 200 . In addition, 21p and 21q are metal plates for mounting the ceramic capacitor 200 . The lead wires 11p and 11q are composed of, for example, steel wires with a diameter of 0.5 [mm], and the metal plates 21p and 21q are composed of plate-shaped members formed by forming a steel plate with a thickness of 1.2 [mm], for example. [0004] When mounting the ceramic capacitor 200 on the metal plates 21p and 21q, usually, the lead wire 11p and the metal plate 21p are welded, a...
Claims
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IPC IPC(8): H01L21/60H01L23/488
CPCB23K11/0026B23K11/004B23K2201/38B23K2101/38H01L2924/0002H01L2924/00
Inventor 安田武史西冈昭彦
Owner OMRON AUTOMOTIVE ELECTRONICS CO LTD