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Solder ball positioning method

A positioning method and solder ball technology, which are applied in the assembly/disassembly of contacts, electrical components, etc., can solve the problems of empty welding and large drop of electrical connectors, and achieve the effect of good welding and improving coplanarity.

Inactive Publication Date: 2010-01-27
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, after the pressing is completed, the insulator body 2 returns to warping, and the unevenness of the solder ball 1 attached to the insulator body 2 has a large drop. Therefore, the solder ball 1 cannot be completely connected to the circuit during soldering. The solder paste on the gasket 40 of the board 4 is in contact, and it is easy to cause empty soldering between the electrical connector (including the insulating body 2 ) and the circuit board 4

Method used

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Embodiment Construction

[0033] The solder ball positioning method of the present invention will be further described below in combination with the accompanying drawings and specific embodiments.

[0034] The solder ball positioning method of the present invention refers to positioning the solder ball 1 on the insulating body 2 . Such as Figure 4 with Figure 5 The shown injection-molded insulating body 2 is warped, has a top surface 21, a bottom surface 22 opposite to the top surface 21, and four side walls 23, and a plurality of accommodation spaces 20 penetrate the top surface. surface 21 and the bottom surface 22. Both the top surface 21 and the bottom surface 22 are curved surfaces. The top surface 21 is used for loading packaged chips (not shown). A plurality of conductive terminals 5 are correspondingly accommodated in the plurality of accommodating spaces 20 , each of the conductive terminals 5 has a soldering leg, and the soldering leg is close to the bottom surface 22 . The insulating ...

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Abstract

The invention discloses a solder ball positioning method for positioning a solder ball on an insulator. The method comprises the following steps: (1) arranging the insulator on a bearing face, the top face of the insulator faces the bearing surface; (2) arranging a plurality of solder balls in the bottom end of an accommodation space correspondingly to cause the solder balls to form vertex curved face on an vertex corresponding to the bottom surface; (3) providing a stamping jig provided with a downward curved face opposite to bending direction of the vertex curved face, wherein, the bending degree of the downward curved face is equal to or less than that of the vertex curved face; (4) facing the downward curved face to the bottom surface, pressing the solder balls by the stamping jig to further force the solder balls into the accommodation space; and (5) removing the stamping jig. The method helps enhance coplanarity between the solder balls and a circuit board.

Description

【Technical field】 [0001] The invention relates to a solder ball positioning method, in particular to a solder ball positioning method related to an electrical connector. 【Background technique】 [0002] Currently, it is one of the mainstream methods in the industry to realize the connection between the electrical connector and the circuit board by means of a ball array, that is, heat appropriately to melt the solder material so that the conductive terminals of the electrical connector are electrically bonded to the circuit board. [0003] However, this method requires solder balls (ie, solder) to be welded to the planar circuit board evenly, that is, the coplanarity of the two is very strict, so as to obtain good soldering performance. However, during the injection molding process of the insulating body to which the solder ball is attached, a large amount of residual stress will be stored inside the insulating body after the molding is completed due to the following two reaso...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/20H01R12/16
Inventor 朱德祥
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU